SILCOOL™ TIA268GF Liquid-dispensed Silicone Thermal Pad / Gap Filler

Welcome to our detailed overview of SILCOOL™ TIA268GF silicone, a 2-component, soft, thermally conductive material designed to dissipate heat from electronic devices. Its non-slumping, pasty consistency ensures physical stability for optimized processing. This material can be used as a liquid dispensed alternative to pre-fabricated thermal pads, suitable for a wide range of thermal designs in electronic applications.
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Key Features and Typical Benefits:
- High thermal conductivity
- Fast curing at low temperatures
- Easy 1:1 mix ratio by weight
- Remains soft after curing, aiding in stress relief during thermal cycling
- Excellent slump resistance, ensuring it stays in place
- Repairable
SILCOOL™ TIA268GF is a great candidate to consider as a thermal interface for electronic components across various sectors, including automotive, consumer electronics, telecommunications, lighting, and industrial applications.
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