SILCOOL™ TIA2101GF Silicone Thermal Pad / Gap Filler

Welcome to our overview of SILCOOL™ TIA2101GF, a 2-component, soft, thermally conductive silicone material designed to dissipate heat from electronic devices. Its non-slumping, pasty consistency ensures physical stability for optimized processing. This material serves as a liquid dispensed alternative to pre-fabricated thermal pads and is suitable for a variety of thermal designs in electronic applications. It is ultra soft which makes it especially suitable for applications which have, for example, high warpage.
Key Features and Typical Benefits:
- High thermal conductivity
- Fast curing at low temperatures
- Easy 1:1 mix ratio by weight
- Retains softness after curing, aiding in stress relief during thermal cycling
- Excellent slump resistance, ensuring it stays in place
- Repairable
SILCOOL™ TIA2101GF is can be a great candidate to consider for use as a thermal interface for electronic components in automotive, consumer electronics, telecommunications, lighting, and industrial applications.
Sign up for our FREE Electronics Monthly newsletter: go.momentive.c...
For more on Momentive's silicone solutions, check out:
- Silicones for Automotive Electronics & Electric Vehicles • Silicones for Automoti...
- Silicones for EV Charging Stations & Infrastructure • Silicones for EV Charg...