What is gate induced drain leakage in MOSFET ? GIDL in MOSFET?
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- Опубликовано: 26 июл 2024
- This video discusses the one the leakage currents which is dominant in MOS devices at lower technology nodes due to scaling of transistors. It happens due to thin oxide layer. It comprises of two phenomena namely electron and hole pair generation and Band to Band Tunneling due to increase in VDG(Drain to Gate voltage ).
1. GIDL happens when device is technically supposed to be in off state as Vgs is less than Vt , but in reality device leaks out some currents. One of the major contributor to this leakage current is GIDL.
2. GIDL increases static power consumption of the device.
Ways to reduce GIDL:
1. Increasing the permittivity of the oxide.
2. Adjusting the drain doping such that the band bending in the deep depletion region does not exceed the silicon band gap and electric field in Si does not exceed the critical electric field for Band to band tunneling ,can reduce GIDL.
3. Using Halo doping.
#semitech #GIDL #MOSFET #VLSI interview #analog design interview #gate_preparation
Thank you, this was very helpful!
My pleasure ! Happy learning 🎆 Thanks for watching
do more videos sir
it would be helpful us 🥰
Really good explanation. May i know if there is anyway i can make it as my reference in my thesis?
Great to know that you liked this video. I believe it's not a good idea to have a video in reference. But I can share a couple of references (papers & books) which you could give for the reference for GIDL. You can mail me at niranjan.rvceit@gmail.com
Thankyou for the explanation 😊 can you suggest any good book for short channel effect please 😢
Hey Sreemukhi kottada
you can find it here -
www0.cs.ucl.ac.uk/staff/ucacdxq/projects/vlsi/report.pdf
Density of knowledge is high
Thank you 😊 stay connected for more electronics videos.
Jab voltage vds apply kr rhe h toh vdg kyo liya ???
Bcz drain leakage current is induced by the gate. Apparently, as vds increases Vdg increases as well..which leads to overcome of gate and drain region beneath the gate. Which leads to leakage current.( As explained in the video)
Thereby without taking Vdg into context one can't analyse it. Hope you are able to comprehend.
Is there any alternative method to replace Bottom silicon insulator technoligy to more enhanced for reduce threshold leakage
yes , using High-k/Metal Gate (HKMG) Technology:
High-k dielectrics and metal gates can be used to replace traditional silicon dioxide gates. High-k materials have a higher dielectric constant, which allows for a thicker gate dielectric without compromising performance, thereby reducing gate leakage.
Other techniques are GAA, FinFETs, Fully depleted SOI .
Hope it helped. Thanks for watching the video.
@@semitech01 is it possible to use high k/metal gate in Gaafet
Yes, it is possible to use high-k/metal gate (HKMG) technology in Gate-All-Around Field-Effect Transistors (GAAFETs) to reduce leakage current. The integration of high-k dielectrics and metal gates in GAAFETs can significantly enhance their performance by improving gate control and reducing gate leakage.
For more you can refer below paper
www.researchgate.net/publication/4357573_45nm_High-k_metal_gate_strain-enhanced_transistors
@@azamatbezhan1653 Yes, it is possible to use high-k/metal gate (HKMG) technology in Gate-All-Around Field-Effect Transistors (GAAFETs) to reduce leakage current. The integration of high-k dielectrics and metal gates in GAAFETs can significantly enhance their performance by improving gate control and reducing gate leakage.
To know more you can refer :
www.researchgate.net/publication/4357573_45nm_High-k_metal_gate_strain-enhanced_transistors
@@semitech01 best answer