Thanks for your concern. I was very busy and just didn't have time for that. I will try my best to upload again hopely from Jan. 2024. Thank again for your kind words.
Yes, SoC at the center of 55mm body 2.5D package is smaller than 55mm but still it is too big for smartphone and performance is too high for smartphone.
![[Eng Sub] 2.5D Package Technology: GPU+HBM, AMD, nVIDIA, TSMC](http://i.ytimg.com/vi/EuBRa3NWMPs/mqdefault.jpg)
![[Eng Sub] 2.5D Package Technology: GPU+HBM, AMD, nVIDIA, TSMC](/img/tr.png)
![[Eng Sub] TSV (Through Silicon Via) - HBM, Silicon Interposer, CMOS Image Sensor, MEMS](/img/1.gif)
There was another guy who had a 20 minute video introducing HBM but never said it meant High Bandwidth Memory. You did it in 18 seconds. Thanks.
Thank you for the clear explanation
There hasnt been any uploads in the last 2 years. Hope things are good with you.
Regards,
A genuinely concerned fan.
Thanks for your concern. I was very busy and just didn't have time for that. I will try my best to upload again hopely from Jan. 2024. Thank again for your kind words.
Harris John Gonzalez Timothy Robinson Shirley
Can we put it in smartphones
No we can't. Usually its package size is around 55mm x 55mm and it is getting larger. It is for high performance computing and not for smartphone.
@@semicontalk3223 the soc would be smaller
Yes, SoC at the center of 55mm body 2.5D package is smaller than 55mm but still it is too big for smartphone and performance is too high for smartphone.
@@semicontalk3223 that does not mean a custom small soc could be made.
@@semicontalk3223 I have researched hbm pim in smartphones and it has been hinted to existent.