[Eng Sub] TSV (Through Silicon Via) - HBM, Silicon Interposer, CMOS Image Sensor, MEMS

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  • Опубликовано: 27 окт 2024

Комментарии • 10

  • @haoxu4328
    @haoxu4328 3 года назад +3

    As a Bosch employee, I was really happy to hear that such a cool process was named after our company. Thank you for your videos, from which I can always learn a lot.

    • @semicontalk3223
      @semicontalk3223  3 года назад +2

      Thanks for watching and that is a privilege for the company who pioneered new technology.

  • @vincentwong4581
    @vincentwong4581 2 года назад +1

    Thank you so much for all these videos! So informative! Btw can you do a video on RDL as well?

    • @semicontalk3223
      @semicontalk3223  2 года назад

      Thanks for watching. Please check below my videos and you will get some information about RDL.
      [Eng Sub] Wafer Level Chip Scale Package (WLCSP)
      ruclips.net/video/F0WLyZZDyeo/видео.html
      [Eng Sub] Fan Out Wafer Level Package: Apple iPhone, TSMC InFO, Qualcomm
      ruclips.net/video/R7ssguwtef4/видео.html

    • @vincentwong4581
      @vincentwong4581 2 года назад +1

      Spot on thank you ☺️

  • @shs2533
    @shs2533 3 года назад +2

    언제나 잘보고 있습니다. 제가 영어 실력을 많이 늘려야 겠네요. ㅋ

    • @semicontalk3223
      @semicontalk3223  3 года назад

      시청해주셔서 감사합니다. 저도 매일 영어공부 하는데 쉽지 않네요 ^-^;;;

  • @shahzaibali7768
    @shahzaibali7768 2 года назад +1

    Can I get this ppt?

  • @KRISHNAPALL-jy1df
    @KRISHNAPALL-jy1df 3 месяца назад

    Hi