Packaging Part 2 - Introduction to IC Packaging

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  • Опубликовано: 28 окт 2024

Комментарии • 11

  • @lingdeer
    @lingdeer Год назад

    Great video! 👍 thank you!

  • @casiof21
    @casiof21 9 месяцев назад

    Many thanks.

  • @JeremyFBlack
    @JeremyFBlack 3 года назад +1

    Your Introduction to IC Packaging playlist is in the middle of your Physical Assurance and Inspection of Electronics playlist.

  • @vince9072
    @vince9072 3 года назад

    Great stuff. Can give more insights on test sockets and testing equipment ?

  • @urimtefiki226
    @urimtefiki226 4 месяца назад

    Stacking of ICs one above other in layers connecting them together.

  • @ErossaanBooming
    @ErossaanBooming 3 года назад

    @11:57 is that Processor wire bonded to the substrate? is it a choice of the manufacturer? can we connect it using FC and BGA to make use of the space occupied by the wires?

  • @clearheartboy777
    @clearheartboy777 3 года назад

    could you please share the link for which you discuss about BGA PGA etc. Because videos are really shuffled in videos section

  • @Munawarkhan107
    @Munawarkhan107 2 года назад

    Thank you Sir.

  • @晚霞-b3f
    @晚霞-b3f 3 года назад

    semiconductor-wafer-slicon-substrate-gold-electronic compose of circle;

  • @debojitmandal8670
    @debojitmandal8670 2 года назад

    question is what is packaging in the first place

  • @yisehakg5039
    @yisehakg5039 2 года назад +1

    Thanks. ................ AUDIEO Please please make it louder.