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very exhaustive coverage. thank you

Valuable channel!!! 🎉🎉🎉

You are missing some old packages.

You are an amazing professor, much thanks to your video from a Taiwanese kid .

thanks

Lots of audio stuttering in the video? It sounds like the audio is chopped up and every other word is repeated. Makes it hard to watch.

Great Lecture!

so useful video

Very useful information, Please correct some typo in Glossary slide like:- WLP(Wafer level Packaging), IoT(Internet of Things),

Gr8. Informative

🎉🎉🎉

I need some CBO. If you can go, knock on the whatsapp number

Great video series. Which tools are used to design the interposers? PCB tools and Gerber files as output OK?

Excellent rundown! Ty.

great presentation, do you have the slides that can be shared?

No Mr Die, I want you to Bond

Is SiP the transition technology to achieving SoC so far? or is is a way better solution than SoC?

IDM

Very Informative lectuer thank Prof Navid !

Well done, Navid!

不错

On slide WLP Challenges: "Nickel" instead of "Nitrate" for UBM?

nice! thank you

For mold first the carrier wafer is only needed during molding, right? Why does it have to be silicon?

correction no. 2: (15:35) - there are sockets for BGA;

Motorola 68020 has PGA package from 1984

Please share your contact details Please

Things that I can learn for one month it takes five years since 2019.

Now computer design tools actually integrate all of these domains 9:26 kind of their own in the background. My algorithm is doing that configuration through 'Logical optimization'.

Stacking of ICs one above other in layers connecting them together.

very good lecture

Take a look at entire series

Thank you very much☺

Amazing video !

سلام و احترام جناب اسدی.ممنون از آموزشهای بسیار خوب شما. جناب اسدس من دانشجوی ارشد فوتونیک در ایران هستم و دنیال یک مثال آماده nonlinear micro ring resonator هستم.آیا شما چنین مثال آماده ای که با FDTD شبیه سازی شده باشد دارید؟ یا منبع و پایگاهی سراغ دارید که دانشجویان فایلهای شبیه سازی شان را به اشتراک بگذارند؟

reading peed is too fast to follow

I can't wait for engineers to start writing software in a form that can be read by these systems, so we'll finally have software and hardware unified.

Thanks for the comprehensive overview!

Daniel, Nice overview Please consider a takeaway statement at the bottom to highlight your conclusive intent 1,000 points

awesome lecture, thank you!

What can you say about durability, long lifespan of Power management IC units in Chiplet

Is it possible to get the slide deck?

good video 🙏 but it's awkward for a package substrate introduction video, ABF is not mentioned at all....

all big and great company in the world😮

Very informative

Great video!

سلام و احترام جناب اسدی. امکان راهنمایی و کمک در انجام پایانامه رشته فوتونیک وجود داره برای شما؟

Many thanks.

Thanks a lot Dr. ❤

Great video, seems like you put the same section once, when talking about thermal reflectance microscopy, please check it out, thanks!