I would expect more knowledge and less "probable" statements, and what you see good and poor design practices. I would expect more professionalism. The integrated circuits have markings, and this is the first to check to understand functionality. Other materials are also well known - like EMI gaskets, cans, etc... What I see here is a proper design - heat spreader, good thermal contact through thermal gaskets between power amplifier and other heat-dissipating components prevents overheating, the good EMI shielding to pass the FCC EMI tests. Few obvious notes: having WiFi (and other radios) as modules reduce the cost of the FCC certification because the pre-certified modules may reduce the cost if recertification; the foam gaskets around all openings are required to reduce the "wind noise" and make predictable frequency response when using compression speaker drivers; that us the reason for other foam isolation elsewhere. The glue for capacitors and other large components is for preventing resonances and vibration noise from "loose" mechanical contact between components and boards. Overall, I would say that this design uses good engineering practices, but the explanation is a bit "naive".
I paid $110 bucks for a new one at a pharmacy of all places.
I’m happy.
Do you happen to know the specs on the mid woofer? I have one that I need to replace and can't find specs for a replacement speaker anywhere.
This speakers are monstrous
I would expect more knowledge and less "probable" statements, and what you see good and poor design practices. I would expect more professionalism. The integrated circuits have markings, and this is the first to check to understand functionality. Other materials are also well known - like EMI gaskets, cans, etc... What I see here is a proper design - heat spreader, good thermal contact through thermal gaskets between power amplifier and other heat-dissipating components prevents overheating, the good EMI shielding to pass the FCC EMI tests.
Few obvious notes: having WiFi (and other radios) as modules reduce the cost of the FCC certification because the pre-certified modules may reduce the cost if recertification; the foam gaskets around all openings are required to reduce the "wind noise" and make predictable frequency response when using compression speaker drivers; that us the reason for other foam isolation elsewhere. The glue for capacitors and other large components is for preventing resonances and vibration noise from "loose" mechanical contact between components and boards.
Overall, I would say that this design uses good engineering practices, but the explanation is a bit "naive".