IEDM Tutorial: Fundamental Review Semiconductor Advanced Packaging-Heterogeneous Integration Roadmap

The global semiconductor industry is projected to become a trillion-dollar industry by 2030. This is historic considering that it took the industry 55 years to reach half a trillion dollars in size and will take just another 10 years to double in size to a trillion dollars. Advanced packaging as it relates to heterogeneous integration will play an important role in making this happen.
This tutorial will cover the fundamentals of advanced packaging covering the past and present state of the art including what is necessary in the future to enable heterogeneous integration. Metrics used to compare these technologies will be discussed.

[@ins_ani]

I am surprised this video has only 4k views. This is the simplest explanation I have found on how packaging and optical interconnect will explode the semiconductor world.

[@Sbd3302tr]

Hey! Any other tutorials or short courses from IEDM?

[@seanjorgenson7251]

Atomeras MST

[@reenakeetch2980]

💃 Promo SM