Co-Packaged Optics for our Connected Future

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  • Опубликовано: 24 янв 2025

Комментарии • 9

  • @simeonradev7174
    @simeonradev7174 Год назад +5

    Thank you for posting this lecture. Very efficiently communicated and pertinent 🙂

  • @nathanclin70
    @nathanclin70 Год назад +1

    Great talk! Such clarity and logical flow!!

  • @telugujoshi
    @telugujoshi 7 месяцев назад +1

    Super condensed but very clear explanation which touches on all the questions I had on Optical Interconnect.

  • @Jimmy-cz2ze
    @Jimmy-cz2ze 3 месяца назад

    Great stuff. Thank you!

  • @rajkrish4702
    @rajkrish4702 Год назад +1

    Great talk

  • @peterdoyle8571
    @peterdoyle8571 Год назад +1

    What about a glass based motherboard that holds all the optical waveguides lasers etc. the plug and play chips could then be manufactured based on a standard for a pin or glass beed based input output from their own glass based bonded substrate. In essence many of the copper pins and tracings would be replaced by waveguides and standardized plug and play interconnects powered by standardized motherboard lasers.

  • @waferlayout
    @waferlayout Год назад

    CoWos technology of Tsmc ❤👍

  • @arashyusefi1889
    @arashyusefi1889 Год назад

    Thanks Microelectronics