Low temps over long time is bad for the pcb and smd components, My hot air station had a defective heat sensor and it destroyed 3 expensive motherboards while working on it, Got new hot air station. doing always at 380, 420 degree and the results are the same as in the video. cheers
SMD Components have specifications for how long and how hot you can go. Read the datasheet. As a rule of thump, the temperature that melt solder is usually limited to less than 15 seconds. Pre heating is usually done at 150c. This is done to shorten the time you spend at higher temp.
I am almost always inclined to use higher heat for quicker in and out most of the time on all soldering and rework. However, I have been wondering more and more about how much damage was done by stressing the PCB and nearby components by not doing a ramp-up pre-heating first. I have been reading more and more about ceramic caps developing cracks that come back to haunt us later.
I think like Sirius Enigma! In lot cases when you have the possibility to raise Temps it will be faster and not so much stressful for the PCB and other components but u should look into the datasheets of the IC what u working on to be save! Thanks for your video and spending all the Time for it to make this nice comparison!
opposit side cpu also can say same things? im always afraid when i remove oppsit side of cpu. higher temp and fast is better than lower temp? thanks great video.
@@RepairLab I am in electronics for more than 40 years, I do the same, my hot station is set to 350C. I prefer to use more temp and lower time. Good Job. Cheers.
It's the same concept. Heat transfers over time so if you lift the chip faster, heat spreading on nearby components will be smaller than if you do it with less heat that takes much more time... This can be probably shown better with a thermal camera but I don't have one. .
A great video, the experience is very useful, I have only one question is whether I can use the heat of 400 C to remove cpu, ram on the phone. thanks AD
Brilliant video. I learned a very valuable lesson here. Thanks. However, what difference would using a preheater make? Would the temperature required be lower but the time the same? Would it be safer for the board? Do you have a preheater to test this?
Hello thanks for your comment. Preheater would make a huge difference actually. The basic idea is that using a preheater you keep the board to a specific high temp. This reduces heat dissipation dramatically thus allows us to use lower heat on top. So using a preheater its almost the opposite concept.
@@RepairLab I think the Quick just doesn't display its output temperature as accurately (when heating). I mean, that it shows it is at temperature before it actually is. Probably related to temperature sensor position etc. Doesn't mean its regulation is bad though of course.
Hi, great video learnt a lot from this. I have a question. I have fixed several iPhone 6S tristar ICs. Most every time they charge fine after the repair but all the time they drain fast like 1% every minute. The weird thing is that they only drain like that when using the phone but on stand by they don’t drain. I use 320c with airflow at 55 when desoldering the ic when soldering back on the new ic I use less air flow at 45 but same temp. I am using a quick 861DW solder station. Any input of what I might be doing wrong would be greatly appreciated. Thanks!
Thanks for the video. The higher temperature was set to 400C but what was a real temperature of the hot air flowing to IC? And what is the highest temperature that can be used before IC is burned?
Hello, the temp shown is the temp near the heating element of the hot air station. So the actual temp of the air flowing on the IC should be less. But why is this even matters? Numbers don't really matter. Not every IC has the same tolerance when it comes to heat.
Lad Bla Listen, most ICs will make it through soldering. That's why they are on board and they work. Some of them are more sensitive to heat some are underfilled and so on. There is no a specific rule to follow. e.g. We know from experience that wifi module is sensitive to heat so its always better to reball it with leaded solder balls in oder to solder it back with less heat.
Low temps over long time is bad for the pcb and smd components, My hot air station had a defective heat sensor and it destroyed 3 expensive motherboards while working on it, Got new hot air station. doing always at 380, 420 degree and the results are the same as in the video. cheers
so you use 380C to take off parts or 420?
@@davidvalens3337 between
I use 400 just experiment
Remember those hot air
Gun temps aren't accurate
SMD Components have specifications for how long and how hot you can go. Read the datasheet. As a rule of thump, the temperature that melt solder is usually limited to less than 15 seconds. Pre heating is usually done at 150c. This is done to shorten the time you spend at higher temp.
I am almost always inclined to use higher heat for quicker in and out most of the time on all soldering and rework. However, I have been wondering more and more about how much damage was done by stressing the PCB and nearby components by not doing a ramp-up pre-heating first. I have been reading more and more about ceramic caps developing cracks that come back to haunt us later.
Interesting video! Watched at 2x the speed it becomes really good :)
😂 You d killed me man.... the real relativity theory...
Cant imagine watching this on 1x speed anymore 😂
@@TuncayAyhan It's pretty painful, still a really useful video
i use higher heat for remove bad ic and low heat for install new one so the new ic can not be dammged
The author carried the thrill along with him ..Thank you very much
Thanks for the video saved me a lot of time testing myself.
I think like Sirius Enigma! In lot cases when you have the possibility to raise Temps it will be faster and not so much stressful for the PCB and other components but u should look into the datasheets of the IC what u working on to be save! Thanks for your video and spending all the Time for it to make this nice comparison!
Watch the video on 1.5x speed and you will be satisfied :)
What type of flux do you recommend wich doesn't dissipate fast and can i swap emmc chips without reballing if the balls a ok
opposit side cpu also can say same things? im always afraid when i remove oppsit side of cpu. higher temp and fast is better than lower temp? thanks great video.
It should be according to smd components temperature profile
Excellent information! Thank you.
Good morning bro,, just saying as I thought you just woke up for making video
good video there is lots of people saying that lower heat is better but I am glad you took the time to test it :)
Thanks buddy!
In the vídeo is shown that is better higher temps ans less time , the neighboards ics get Hot less
@@RepairLab I am in electronics for more than 40 years, I do the same, my hot station is set to 350C.
I prefer to use more temp and lower time.
Good Job.
Cheers.
@ElectroniCs No, multi layer boards need more heat, maybe 380C.
Best Regards.
But what about the components on the other side of the motherboard like the underfilled components amd the cpu?
It's the same concept. Heat transfers over time so if you lift the chip faster, heat spreading on nearby components will be smaller than if you do it with less heat that takes much more time... This can be probably shown better with a thermal camera but I don't have one. .
A great video, the experience is very useful, I have only one question is whether I can use the heat of 400 C to remove cpu, ram on the phone. thanks AD
Hello from Russia , very usefull info thx !
Brilliant video. I learned a very valuable lesson here. Thanks. However, what difference would using a preheater make? Would the temperature required be lower but the time the same? Would it be safer for the board? Do you have a preheater to test this?
Hello thanks for your comment. Preheater would make a huge difference actually. The basic idea is that using a preheater you keep the board to a specific high temp. This reduces heat dissipation dramatically thus allows us to use lower heat on top. So using a preheater its almost the opposite concept.
Iphone 6s cpu damage on 350 heating.during the u2000 ic replacement.why?
Nice demo. Clearly the quicker IC is removed in this circumstance is best. Is it me or is the hakko slow to heat up to set temps?
True hakko used to be slow compared to quick 861
@@RepairLab I think the Quick just doesn't display its output temperature as accurately (when heating). I mean, that it shows it is at temperature before it actually is. Probably related to temperature sensor position etc. Doesn't mean its regulation is bad though of course.
Hi, great video learnt a lot from this. I have a question. I have fixed several iPhone 6S tristar ICs. Most every time they charge fine after the repair but all the time they drain fast like 1% every minute. The weird thing is that they only drain like that when using the phone but on stand by they don’t drain. I use 320c with airflow at 55 when desoldering the ic when soldering back on the new ic I use less air flow at 45 but same temp. I am using a quick 861DW solder station. Any input of what I might be doing wrong would be greatly appreciated. Thanks!
benben20 Hello, how do you diagnose that tristar is the culprit ?
Thanks for the video. The higher temperature was set to 400C but what was a real temperature of the hot air flowing to IC?
And what is the highest temperature that can be used before IC is burned?
Hello, the temp shown is the temp near the heating element of the hot air station. So the actual temp of the air flowing on the IC should be less. But why is this even matters? Numbers don't really matter. Not every IC has the same tolerance when it comes to heat.
Thanks for the reply. But how do you find a proper temperature to use, if different IC have different heat tolerance?
Lad Bla Listen, most ICs will make it through soldering. That's why they are on board and they work. Some of them are more sensitive to heat some are underfilled and so on. There is no a specific rule to follow. e.g. We know from experience that wifi module is sensitive to heat so its always better to reball it with leaded solder balls in oder to solder it back with less heat.
OK, so what temperature do you use for those sensitive IC without any risk of damage during desoldering/soldering?
Thanks
Thank you very mach
I was using low heat for long time that was bad idea and most of time ic get dead
Trying to watch this , I'm having difficulty removing chip gl3520 usb ic
I'm using high heat probably I should use low
great information thanku sir
This is my old comment i lost that id. After 2 year i found it
very clever ! nice video ... the best !
Does he talk like that all the time, or just he woke up ?
380 c is it safe?????
desoldering ok.But what about the soldering time
yemmes sudheer sudheer soldering time is not so important cause most of the times we use leaded solder which melts lower than lead-free..
@@RepairLabThanks for the reply .
If i use higher temp ,my board will burn.
If I use low, not melting ang damage otherside
400 smd capacitor not damge??????
hot n fast always best
nice
he bro qucik 861dw testing next video
Get some coffee, you sound extremely tired
How about making the video when you wake up as it is ssssssooooooo sssslllloooooowwwwww and your rambling on
I thought maybe he was high.
ρε μάστορα... πάμε λίγο ποιό ζωηρά!!!
This is the first video where I regret that YT don't have higher playback speed than 2x. You will be great for bed time stories but not the YT videos.
Are you still sleppy?
Oh boi. I had to watch this video at 1.25x speed to keep my sanity.
watch at 2x speed and thank me later
👏👏👏👏😍
zzzzzz