This method looks very easy. But practically it is not. Usually we happen to do this kind of work as a rework. There are many parts already installed nearby. Here there are no other parts, no pads connected to ground. The thermal pad of the chip was ignored. And the board appears to be a double sided (two copper layers) only. When it comes to a board of eight ten layers with heavy density of copper and several pads connects to ground , picture is completely different. We have to use a hot plate to preheat, under the cradle, which holds the board and place everything under the microscope. Then we have to perform the soldering as in the video, sometimes with the help of hot air gun. Everything should be done very carefully, taking care not to burn any connector or part because under the microscope we can see very limited area only. When we perform our duty very carefully, the worst thing is our employer used to bring his laptop to show us these type of videos and points us " See , how quickly the youtubers do this."!!!!!!!!!!!
For hobbyist projects you make sure to make PCB designs that make manual assembly easier. You don't use the smallest pitch ICs or 0603 passives etc. And chips like these are often soldered with solder paste and hot air.
This method only works well for a footprint designed for "handsoldering" with iron. That is why pads on breakout board are long enough so it is easier to get heat transfer with regular soldering iron tip.
Платон Карпов, цель была убить микросхему? "Пузо" к плате паять надо обязательно. И потом каждый слесарь знает где бывают дырки. Отверстие это не мешает никак. Феном не феном, а залудить выводы микросхемы перед пайкой обязательно надо (Есть исключения. Но не в данном конкретном случае.). )
I see this particular package type causing a lot of cold solder failures in equipment we repair. Seems that the TQFP packages are better as their actual leads are more capable of dealing with thermal expansion?
And with high speed signals (these are not), you cannot solder to the leadframe (side of package), well you can, but it reduces high speed preformance.
@@Ozzy3333333 Why is that? I was under the impression those were just test points and if solder sticks to them theres no issue. I'm curious why that would impact high speed performance?
@@MadJDMTurboBoost My company is doing the bleeding edge of tech, high speed data, each year we reduce the sice of the ac coupling caps, 0402, 0201, 0105, etc, each disturbance of the high speed signal has a reflection, the smaller the component the less reflection. The pads on the part keeps getting smaller, so now you cant solder to the leadframe like I did 5+ years ago, it just screws with the signal (in a bad way).
You forgot to solder the thermopad/GND Pad that located underneath the chip ,which may be very important for the performance of chip align with the specification.. when soldering QFN with thermopad . hot air soldering and drag soldering method shall be applied
Soldering only the terminals of component without the soldering the thermal pad can lead to malfunction due to overheating. For this type of component air heat soldering method is better to be used.
NEY Industries, ну это логично, но по факту я так понимаю это делалось что бы сделать видео перфекциониста. Так же можно снизу прогреть и подложка прихватится
The advantage you have here is the large pads to allow you to use a relatively large tip when soldering. It's sucking the solder up from the joint. Problem is that when you follow the manufacture's footprint guide you get minimal area. In production thankfully I'm using a stencil and a convection oven. But sometimes I do need to rework these devices and what I do isn't too dissimilar to this video. Using a large chisel tip iron, lots of flux (liquid rather than paste) and make a big blob of solder to be dragged along the side of the IC. Replacing these ICs you need hot air. What I've also found is that with ICs that have a large thermal pad you also need to add a heater underneath the board. Set it to 100 / 150C so that your hot air has less work to do. You'll do less damage, or none at all, this way! Replacing just carefully put down some solder paste, you don't need much, and then again back to the hot air. But they really are an absolute pain these packages!
@@hugepines3990 We now have 60x60mm 3488 pad packages (80amps), these need everything correct to get them working. I still believe the 56 Gbaud are the hardest, everything needs to be perfect.
Hey all, I've been trying to find some flux cleaner like OP used in his video. The dispenser looks pretty practical, can someone point me to where I could find that kind of bottle ? Thanks !
Awful. Pretty good equipment, but the master, sorry for my French, with arms from his ass. Makes silly noob errors (didn't solder IC exposed pad, choosing not suitable tips, etc.).
if you didnt notice the best joints he did was the 2nd row when he did only a few at a time and started away from it and slid in lightly touching the side of the chip with the tip only... 2:45 But here is a question the small brown pads in the corners is that for automated grip points or they maybe ground or heatsink contact points or something? also long as the trace isnt damaged you can always paint over trace cover with a matching clearcoat and use alcohol to blend the edges.
The brown bits are exposed parts of the leadframe that have been cut flush, they help to keep the leads and the IC from moving while they encapsulate the part. The leads are cut and trimmed and the rest of the leadframe is removed at the same time.
Если так на печатке запаять - не сложно. Плюс брюхо не пропаяно. Я паяю так: аккуратно залуживаю посадочное место и чип. На чипе должны получиться бугорки на выводах. Совмещаю чип и посадочное место. Грею феном до момента посадки. Проверяю микроскопом правильность посадки.
Hi and thank's for your video. Il think you put too much flux. You'v got long soldering pads, may be better for hand soldering, long but thin, and you could unstick them because your too long to solder. Also note that there are QFN packages with only 4 pins each side and you put too mutch tin on your wave iron. The way you do with these chips it would be a mess and finally a single short through. I Think you must also own a smaller wave pin to achieve better job. Lower a bit temp, and not feeding the iron wave each time : flux will prevent tin to burn if temperature isn't too hight. We learn by doing. Have fun!
Don't ever do this with a ceramic-packaged IC (or ceramic caps). You'll crack them every time. Those will probably be visible only under a microscope, but will affect the performance and longevity of the part.
I’ve done A LOT of fine pitch soldering in my life and I HATE QFN ICs! 👎 Just one question. Why didn’t you solder the heat sink substrate in the center? That should’ve been done first.
You have to beat for such soldering! With your feet! The central "pad" is not soldered! This means no “grounding”. There WILL BE NO cooling through it!!!
What about the exposed pad on the bottom of the QFN? There are holes in the bottom of the PCB to allow solder to be flowed by hand to the exposed pad. On many chips, this exposed pad is the sole ground. So it's quite possible that this soldering will not allow this chip to work. WTF?
Neat, but not a QFN soldering you expect :) The "real" one is not much harder though, the main difference is you also have to tin the package terminals to get the same pillow shape as you got on the PCB pads. And better use a blowtorch with a catalytic nozzle as advised in some (can't recall which one exactly) repair note instead of hot air gun, makes things way easier as nothing gets blown off.
I do not recommend this way, even it looks easy , it is not. And in this video thermal pad is totally ignored. Thermal pad exist with a reason , it should not be ignored. However I love your channel and your work, I am around here on daily basis, so keep good job and everyone can do mistakes so no worries . Thumbs up.
По моему у него жало паяльника огромное... да можно использовать паяльную пасту. Но это дорого. Всё как-то оч грубо, не соответствует масштабу процесса. Поменьше надо и поаккуратнее...
Слишком легко. Под пузом отверстия, куда лишний припой можно выдавить при пайке ИК или феном, боковые контакты длинные.. Мне приходилось паять QFN48, и дырочек не было под ней, и боковые короткие - паяльником не подлезишь, не с первой попытки получилось наплавить нужное количество припоя. Это непросто.
Всем русскоязычным 1) он не припаял массу микросхемы, которая одновременно выступает теплоотводящим элементом 2) паечные мосты снимаются только чистым жалом при нанесении флюса каждый раз 3) он за каким то чёртом снял старый припой, и сам же написал что нужно быть осторожным, для тех кто не в теме объясню, если много тыкать паяльником в такие посадочные места, то контакт просто перегреется и оторвётся от текстолита А вот вам инструкция как надо делать 1) Аккуратно лудим площадки с флюсом, в т.ч. и массу(пузо) на печатной плате 2) включаем фен на 270 градусов и усаживает микросхему на свое место 3)еле еле толкаем микруху под феном, если микросхема вернётся на свое место, то убираем фен, она на своем месте 4) если есть не пропаянные ножки, аккуратненько с флюсом тонким жалом пропаиваем каждую отдельно а не все подряд Профит, микросхема установлена
Soldering has never been so emotional
Emotions harm business. Emotions are not bad, but very dangerous.
Tears dropping from my eyes while watching it :'(
And soothing, calming and
relaxing.
Everyone must agree that it is way better than that annoying beats in viral diy videos.
If you really loves work , then Brain will release good dopamine 😊
good presentation 🎉
This method looks very easy. But practically it is not. Usually we happen to do this kind of work as a rework. There are many parts already installed nearby. Here there are no other parts, no pads connected to ground. The thermal pad of the chip was ignored. And the board appears to be a double sided (two copper layers) only.
When it comes to a board of eight ten layers with heavy density of copper and several pads connects to ground , picture is completely different. We have to use a hot plate to preheat, under the cradle, which holds the board and place everything under the microscope. Then we have to perform the soldering as in the video, sometimes with the help of hot air gun. Everything should be done very carefully, taking care not to burn any connector or part because under the microscope we can see very limited area only.
When we perform our duty very carefully, the worst thing is our employer used to bring his laptop to show us these type of videos and points us " See , how quickly the youtubers do this."!!!!!!!!!!!
вот и хуй-то!!!а автору похуй на это!......и это,я бы слал на хуй таких клиентов!!!
For hobbyist projects you make sure to make PCB designs that make manual assembly easier. You don't use the smallest pitch ICs or 0603 passives etc. And chips like these are often soldered with solder paste and hot air.
Next time your employer says so, ask him to hire the youtuber.
@@NicolaiSyvertsen Yes
@@ManishKumarIITG 😂😂😂
Two o'clock, middle of the night and I’m watching some random dude soldering... Good night
The same, at 3am. Two years later in the middle of pandemia.
3 am and us
Same but in 2021
3:25 am
Dont forget the power pad under the part, you need hot air to mangage to that :)
it can also be achieved with soldering iron from below since there is thermal connection
I think there is a big issue, no solder on the ground/central pad if it's necessary.
not good, need thermo fan for soldering central thermopad chip
This method only works well for a footprint designed for "handsoldering" with iron. That is why pads on breakout board are long enough so it is easier to get heat transfer with regular soldering iron tip.
the saddest qfn soldering video... :-(
when said "unfortunately solder mask damaged..." plus the music, I almost cried
They use the video plot in latest movie, really sad. The move title I think "You beautiful feet shower my lip"
А пузо-то не припаял? Надо-бы сначала феном...
У него просто для показа, так задевает, а тебе конечно, феном надо будет угреть
Дыру видел в плате под микорсхмой? Второе, у него была цель пузо паять? Или ноги тока?
Вот вот, а у пуза как обычно земля и микруха не заработает, или вообще в аут уйдет!
Перегреется и сдохнет, так нам и надо.
Платон Карпов, цель была убить микросхему? "Пузо" к плате паять надо обязательно. И потом каждый слесарь знает где бывают дырки. Отверстие это не мешает никак. Феном не феном, а залудить выводы микросхемы перед пайкой обязательно надо (Есть исключения. Но не в данном конкретном случае.). )
Просмотрев видео вспомнил ролик где чувак говорил это просто охуеный зум 🤣
The tears that will drop from my eyes by watching this video will wreck all my soldering
Thanks for making this video, I'm getting in to SMD/SMT boards myself and this video was very well presented and explained :) I'll subscribe :D
Tut tut 6⁵⁵33 a eoyeruyuey3y3ygggegertgrte tree teddy toy tree
Dude, you make this look like art
Huw abouut the heatsnik pad at zee underzide ¿
the ground under chip is not solder. so effect to chip high temp. and unstable work
Какой микроскоп вы используете?
I managed to weld a 0.5mm QFN 28. I learned with you. Perfect! Thank you very much!
watching this makes me ask myself why I waited so long to get into SMD (as a hobbyist)
Be prepared to practice for a long time.
Questionable soldering by relying on contact with bare copper side pins
I preffer to use hot air to sold QFN's packages, specially because the central pad!!!
А кто пузо припаивать будет? От перегрева чип в скором времени сгорит)))проще феном надуть)
I see this particular package type causing a lot of cold solder failures in equipment we repair. Seems that the TQFP packages are better as their actual leads are more capable of dealing with thermal expansion?
Красиво, но все равно дизлайк, за не припаянную землю. Через нижнюю площадку так же осуществляется отвод тепла.
Ладно тепло, есть микрухи которые еще и питаются с нее!
да видно забыл показать как перевернул плату и пропаял подложку... 😜
Евгений Скрипиль кто такие микрухы !? )
@@TinTaBraSS777 не микрухы, микрухи!
It is a totally different ball game when those leads are not this long. Which is 99.9 percent of the time. But thanks for the video
And with high speed signals (these are not), you cannot solder to the leadframe (side of package), well you can, but it reduces high speed preformance.
@@Ozzy3333333 Why is that? I was under the impression those were just test points and if solder sticks to them theres no issue. I'm curious why that would impact high speed performance?
@@MadJDMTurboBoost My company is doing the bleeding edge of tech, high speed data, each year we reduce the sice of the ac coupling caps, 0402, 0201, 0105, etc, each disturbance of the high speed signal has a reflection, the smaller the component the less reflection. The pads on the part keeps getting smaller, so now you cant solder to the leadframe like I did 5+ years ago, it just screws with the signal (in a bad way).
You forgot to solder the thermopad/GND Pad that located underneath the chip ,which may be very important for the performance of chip align with the specification.. when soldering QFN with thermopad . hot air soldering and drag soldering method shall be applied
Soldering only the terminals of component without the soldering the thermal pad can lead to malfunction due to overheating. For this type of component air heat soldering method is better to be used.
Exactly, preheater and hot air, basic tools for SMD repair. Others methods are patchworking and not reliable.
А подложку припаять?
Если микруха не нагревается то не нужно
Подложку потом на саморезы там есть дырочки
NEY Industries, ну это логично, но по факту я так понимаю это делалось что бы сделать видео перфекциониста. Так же можно снизу прогреть и подложка прихватится
у Россмана гораздо лучше видео по пайке "qfn + Rossman"
ruclips.net/video/mr1UVPsExiE/видео.html
С обратной стороны олова лупануть через отверстия
What type of microscope you use??? And thanks for the videos saludos desde mexico
You didn't soldering center thermal pad and using more flex on rework.it is very easy work .
Hmmm. And what about a big central thermal pad? It can't be done without a fan, isn't it?
MrDatagor i think there should be heat sink paste under IC chip
Some vias holes in thermal pad allow you solder on top or bottom layer by soldering iron
Agree!
And some ICs have on this pad GND power pad. We are using hot air gun for these chips
Androkavo and what if no holes on the other side??? And it's 90% of the time
Damn... the music makes it soooo refreshing
You make this look really easy although I know that it is not, especially with a soldering iron. You must have done this for quite a while now.
The advantage you have here is the large pads to allow you to use a relatively large tip when soldering. It's sucking the solder up from the joint. Problem is that when you follow the manufacture's footprint guide you get minimal area.
In production thankfully I'm using a stencil and a convection oven. But sometimes I do need to rework these devices and what I do isn't too dissimilar to this video. Using a large chisel tip iron, lots of flux (liquid rather than paste) and make a big blob of solder to be dragged along the side of the IC.
Replacing these ICs you need hot air. What I've also found is that with ICs that have a large thermal pad you also need to add a heater underneath the board. Set it to 100 / 150C so that your hot air has less work to do. You'll do less damage, or none at all, this way! Replacing just carefully put down some solder paste, you don't need much, and then again back to the hot air.
But they really are an absolute pain these packages!
I u u
77ii
QFN are a breese, csp even easier, what is tough is the new 56 Gbaud packages.
@@Ozzy3333333 BGA1156 ;P
@@hugepines3990 We now have 60x60mm 3488 pad packages (80amps), these need everything correct to get them working. I still believe the 56 Gbaud are the hardest, everything needs to be perfect.
Good! 👍
Solder that QFN on laptop motherboard ^ ^ good luck !
Funny, taking a QFN package and soldering it to an extension board...
Good soldering though!
Sometimes it is required when you need to test the circuit on breadboard.
Perfeito! Eh gratificante e relaxante ver um trabalho assim bem feito
Where did you get that metal siphon you had on top of the alcohol bottle ?
What is the temperature when you solder this IC?🙏🙏🙏
How about the bottom pad?
for the central ground pad , I would put solder in the hole , from the bottom and heat the pad through the hole with my soldering iron.
Hey all, I've been trying to find some flux cleaner like OP used in his video. The dispenser looks pretty practical, can someone point me to where I could find that kind of bottle ? Thanks !
Awful. Pretty good equipment, but the master, sorry for my French, with arms from his ass. Makes silly noob errors (didn't solder IC exposed pad, choosing not suitable tips, etc.).
Илья X Yep. All of this guy’s soldering videos are beautifully filmed shots showing terrible technique.
Which camera/equipment are you using for zooming?
if you didnt notice the best joints he did was the 2nd row when he did only a few at a time and started away from it and slid in lightly touching the side of the chip with the tip only... 2:45 But here is a question the small brown pads in the corners is that for automated grip points or they maybe ground or heatsink contact points or something? also long as the trace isnt damaged you can always paint over trace cover with a matching clearcoat and use alcohol to blend the edges.
The brown bits are exposed parts of the leadframe that have been cut flush, they help to keep the leads and the IC from moving while they encapsulate the part. The leads are cut and trimmed and the rest of the leadframe is removed at the same time.
Excellent macro photography and editing. Perfect soldering technique 👍👍👍👍👍
All right around but the center you did not solder it to dissipate the heat and make the electric contact good...
Если так на печатке запаять - не сложно. Плюс брюхо не пропаяно.
Я паяю так: аккуратно залуживаю посадочное место и чип. На чипе должны получиться бугорки на выводах. Совмещаю чип и посадочное место. Грею феном до момента посадки. Проверяю микроскопом правильность посадки.
you don't need any soldering for central Ground pad? oh, there are some people mentioned.
Ты покажи на плате где вокруг smd компоненты стоят.
Красиво! Спасибо!
actually makes me think doing a QFN might be easier since the tabs are so small and less likely to bridge than TQFP.
Why is your image so clear compared to others, I've seen, doing the same thing with a microscope?
hi Adam, we are selling microscope, you can see them in my channel.
And what about the power pad? how did you make the soldering?
You missed the power dissipation pad.
I came here for my ASMR of the day. You?
Лютый флюс... Даже маску жрет )
*C'est bien présenté, j'ai compris maintenant comment souder ce type de composants. Merci*
That was nicely done!! What magnifier do you use?
On an empty pcb hell easy. Do it on a laptop mainboard this way then its a thing..
Muito bom seu trabalho, deixo aqui saudação do Brasil.
this is so satisfying
True😋
Concur. Most therapeutic... N relaxing I find when replacing large SMD ICs.
Qfns and qfps are a pain in the ass.
Hi and thank's for your video. Il think you put too much flux.
You'v got long soldering pads, may be better for hand soldering, long but thin, and you could unstick them because your too long to solder.
Also note that there are QFN packages with only 4 pins each side and you put too mutch tin on your wave iron.
The way you do with these chips it would be a mess and finally a single short through.
I Think you must also own a smaller wave pin to achieve better job.
Lower a bit temp, and not feeding the iron wave each time : flux will prevent tin to burn if temperature isn't too hight.
We learn by doing. Have fun!
Don't ever do this with a ceramic-packaged IC (or ceramic caps). You'll crack them every time. Those will probably be visible only under a microscope, but will affect the performance and longevity of the part.
Great footage quality. I would aprecheate voice over music. Explaining stuff, pros and cons. Etc.
I’ve done A LOT of fine pitch soldering in my life and I HATE QFN ICs! 👎
Just one question. Why didn’t you solder the heat sink substrate in the center? That should’ve been done first.
Fail. You didn't solder the thermal pad. Otherwise good job.
You have to beat for such soldering! With your feet!
The central "pad" is not soldered! This means no “grounding”. There WILL BE NO cooling through it!!!
I like to use how air for this especially because most IC have middle large contact for ground or for heat dissipation and i like to solder that too.
What about the exposed pad on the bottom of the QFN? There are holes in the bottom of the PCB to allow solder to be flowed by hand to the exposed pad. On many chips, this exposed pad is the sole ground. So it's quite possible that this soldering will not allow this chip to work. WTF?
มาเป็น Fc sub ใหม่ครับ
i like your confidence anchoring the second spot without checking if there is any misalignment..
Super smooth
Neat, but not a QFN soldering you expect :) The "real" one is not much harder though, the main difference is you also have to tin the package terminals to get the same pillow shape as you got on the PCB pads. And better use a blowtorch with a catalytic nozzle as advised in some (can't recall which one exactly) repair note instead of hot air gun, makes things way easier as nothing gets blown off.
Нижняя часть неприпаяна? Ссылки на флюс и очистительные средства есть?
Great photography but NO thermal/GND pad soldering underneath the IC !!!
I solder QFN with hot air in 1/100 of the time. The best moment is when the QFN allign itself.
Please show 🧐
This is such a beautiful video
So much lint... just use a no clean flux dammit not that tree sap! You're not welding copper pipes. You know nothing John snow
Im trying to replace a P13USB ic for nintendo switch I'm beginner how do I get the solder to connect to the copper pad on the side not just bottom?
In which temperature you soldering?
I do not recommend this way, even it looks easy , it is not. And in this video thermal pad is totally ignored. Thermal pad exist with a reason , it should not be ignored. However I love your channel and your work, I am around here on daily basis, so keep good job and everyone can do mistakes so no worries . Thumbs up.
Hi,you are dont soldering this ground,it is a heatsink.
По моему у него жало паяльника огромное... да можно использовать паяльную пасту. Но это дорого. Всё как-то оч грубо, не соответствует масштабу процесса. Поменьше надо и поаккуратнее...
If there was a reaction of I love it on youtube I would put it ... that work so neat and perfect I loved it
Слишком легко. Под пузом отверстия, куда лишний припой можно выдавить при пайке ИК или феном, боковые контакты длинные.. Мне приходилось паять QFN48, и дырочек не было под ней, и боковые короткие - паяльником не подлезишь, не с первой попытки получилось наплавить нужное количество припоя. Это непросто.
Всем русскоязычным
1) он не припаял массу микросхемы, которая одновременно выступает теплоотводящим элементом
2) паечные мосты снимаются только чистым жалом при нанесении флюса каждый раз
3) он за каким то чёртом снял старый припой, и сам же написал что нужно быть осторожным, для тех кто не в теме объясню, если много тыкать паяльником в такие посадочные места, то контакт просто перегреется и оторвётся от текстолита
А вот вам инструкция как надо делать
1) Аккуратно лудим площадки с флюсом, в т.ч. и массу(пузо) на печатной плате
2) включаем фен на 270 градусов и усаживает микросхему на свое место
3)еле еле толкаем микруху под феном, если микросхема вернётся на свое место, то убираем фен, она на своем месте
4) если есть не пропаянные ножки, аккуратненько с флюсом тонким жалом пропаиваем каждую отдельно а не все подряд
Профит, микросхема установлена
Thank you, What is the microscope brand and model?
GOOD work But I Think U Forget To Sold Bottom Side Of Ic..
Сразу видно что нет опыта пайки.
Need a proper IR heat setup to heat the centre ground connection - thermal pad,
So satisfying, next buy flux. :)
Хрень. Я не великий паяльщик, но с такими длинными пятаками может наверное любой новичок любым паяльником припаять QFN
The childrens music almost put me off the ridiculousness of using a skewer to apply flux
That orange or yellow stuff reminds me of ear wax
How is this pumping bottle called in English? The one where your alcohol is inside?
excuse me.. want to ask.. what solder tip you use.. and what solder type
Great job, congratulations! What is the make and model of your microscope?
no no no ..very bad