半導體封裝的先進趨勢 Trends in Semiconductor Advanced Packaging

#先進封裝 #CoWoS #台積電 #3DIC
先進封裝為何在近年迅速崛起？
所謂時勢造英雄，天助自助者，一方面受到摩爾定律趨近極限的影響，台積電早在數年前就大力發展先進封裝技術，晶片2.5D封裝的概念並非近年所生，甚至早有3D封裝的概念，但AI晶片問世以前缺乏殺手級應用，就連採用台積電最新先進製程的蘋果，其iPhone晶片僅使用扇岀型封裝。
然而如今市場火紅的輝達AI晶片必須採用CoWoS先進封裝，佔據市場近乎9成市場份額的輝達AI GPU供不應求，成為CoWoS炙手可熱的關鍵。
先進封裝會成為半導體下一個長線趨勢嗎？就讓半導體專家 林嘉洤 教授，和金融行銷專家 馬瑞辰 教授 在這集影片裡告訴你！
Why has advanced packaging risen rapidly in recent years?
It is said that times make heroes, and God helps those who help themselves. On the one hand, due to the influence of Moore's Law approaching the limit, TSMC has vigorously developed advanced packaging technology a few years ago. The concept of 2.5D packaging of wafers is not new in recent years, and there has even been 3D packaging for a long time. Concept, but before the advent of AI chips, there was a lack of killer applications. Even Apple, which uses TSMC’s latest advanced process, only uses fan-shaped packaging for its iPhone chips.
However, Huida AI chips, which are popular in the market today, must adopt CoWoS advanced packaging. Huida AI GPUs, which account for nearly 90% of the market, are in short supply, which has become the key to CoWoS's popularity.
Will advanced packaging become the next long-term trend in semiconductors? Let Professor Lin Jiatong, a semiconductor expert, and Professor Ma Ruichen, a financial marketing expert, tell you in this video!
【先進封裝供應鏈】Advanced packaging supply chain
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