Semiconductor Packaging - ASSEMBLY PROCESS FLOW
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- Опубликовано: 16 июн 2024
- This is a learning video about semiconductor packaging process flow. This is a good starting point for beginners. - Watch Learn 'N Play
UPDATE 8/15/2022: FIXED ENGLISH SUBTITLE. PLEASE USE SUBTITLE IF YOU CANNOT UNDERSTAND MY ACCENT (PARDON MY ACCENT AND MY GRAMMAR TOO :) ) 
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Thank you very much for making impressive video. This is absolutely perfect video due to you also add up real processing video including illustrator. I work for semiconductor industry for 16yrs still surprise the way you make video presentation. Please keep going.
Really informative , precise, detailed video… really helpful for those who have no clue about semiconductor packaging. It is very good that you explained all those steps in lay-man terms and not the fancy jargon … Thank you so much .. I will be looking forward to Part 2!
Thanks for the comment. More videos to come
This is amazing! Keep the great videos coming.
Very impressdive. easy to understand for beginners. I learnt a lot from this video. Thank you.
this is an EXCELLENT video! thank you very much!
So helpful I hope you can continue making videos
Thank you for the very informative video sir! We hope you continue to share more of your knowledge po :D Test Engineer here
I study computer science and this was very useful for my computer network architecture class
Very very good video! Thank you!
This video is very informative. Thanks for doing this.
Very informative video good work
Great video man!!!! Thank you so much ❤
very informative yan Sir LGALE......one of most respective Equipment Engineer during our Semicon time...i really miss it!!!......keep it up!!!😀
DBOCA thanks for the positive comment. After 30 years I thought it is time to share the knowledge and experience that I think will be helpful for beginners in the industry and even for those just graduating from college / university. I miss it too! Watch out for more upcoming videos
Great content !
your video sharing is very informative. Thanks for provided
this is really great video and great explanation. maybe it is worth to compare or to explain the new "panel-level-packaging". seems to be new packaging technology. would be great to learn more about it.
Very good video sir...👍👍👍
Excellent! Very detailed. Fantastic info; can't find this elsewhere. Bravo pal.
Great video! 👍
I had work with the position Process Engineer of Wire Bonding stage for one year. I miss KNS Maxum +, Iconn machine.
Very informative, thank you
Thanks!
Thank you for making detailed video. Is DIE attached with wafer tape?
Very informative 👍. Thank you. One request, can you please cover the process of Wafer manufacturing
Galing pre
thank you for sharing
amazing
this is great.
Weldon sir
Is this somewhat the process at the Intel back end semiconductor factory?
I'm glad I watched this *after* I delidded my CPU to apply new TIC to the die. I would've felt like I was diffusing a bomb.
awesome ilustration, thanks for sharing. the next video plz explain about how lithograpy work.
Thanks for the feedback.
learn a lot about process flow .
slay, ur accent is fine :)
Hi, your slide and explanation are really good. Do you mind to share your slide?
Hi! Fantastic video! It is the most detailed video existing. But I don't understand how dies of extremely small size, few tenths of millimeters, like the dies of small transistors like the BC337, can be sawed and separated from the plastic film, without the get pushed away. And how they can be picked up to be transported on the final package. Please could you explain me it, or make a next video for it?
Thanks for the comment. The wafer saw video I posted will give better understanding of the sawing process. I will also create a more detailed video related to die attach process.
@@watchlearnnplay Thank you for your reply! Yes I watched also the video about the wafer sawing. It's very good too! but the dies in the video are big. I can figure how it may work with large dies, but with very small dies, few tenths of millimetres large, it is all different to handle, I guess. Then I am looking forward to watch your video about the die attach! :)
Also concerning large dies, how are they exactly picked up from the wafer, without being damaged? As far I know, nothing should touch the upper surface of a diffused and finished chip, otherwise the material, the structures and tracks would be damaged and the chip would be unusable. Or not? With sub-millimetre dies it is even more difficult. Thank you again for your great videos. Do you work in a semiconductor factory?
GOOD VIDEO EXCELLENT EVEN ... EXCEPT Why didn't you include the full RUclips video links in the description?
Thanks for the feedback. I intentionally did not include the links in the description as I want the focus to be on the learning video. I mentioned the reference video mainly o give credit and respect to the original creator.
The best illustration Semiconductors wafer, chips and devices such as transisors. I hope this discussion be extended to Field effects transistors such as MOSFETS, POSFETS, and Biosensors.
I watched this on my phone while my teacher is presenting this
Happy to know that my video is useful for teaching / learning.
Is this a filipino channel? if so, salamat sa kaalaman kabayan. new test engineer po ako.
Salamat din kabayan
Thanks you for useful video, if you have powerpoint file please share to me, I’m really grateful!
Semiconductor project
Bapak pamudjiid
Please provide information regarding micro bump and hybrid bonding in 3D ICs