Thank you very much for sharing Robert!! Stackup is one of the starting points for every new design and extremely important. It can "make or brake" you entire design...
Nice one Robert. If possible please also provide some suggestions of good reliable multilayer PCB manufacturers especially dealing with blind bias, laser vias, etc. As you know each manufacturer will have their own preferences.
Awesome as usual. ❤️....I recommend the channel to many of my peers....also please share some resources to make RF PCB designs too Robert. I would love to see them on the channel. Such a quality content.
This was very useful. Thank you. As a suggestion for a future topic, RF PCB layout in the 1GHz to 10Ghz region would be very helpful. (Perhaps as a collaboration if this is outside your own experience). Topics like inductors, capacitors and microwave filters made of PCB tracks, via stitching in Altium to help shield tracks and form wave guides etc.
Hi Robert! I loved your guidelines for > 20Gbps signals video. I am a power electronics designer and always struggled to know how far / how long a loop / when two signals (pwm or analogue ) can cross etc. Any video or book with readily applicable knowledge ?
Hello Robert, Can you please discuss the stackups from power integrity perspective? I am not an expert but I am concerned about 2 things that can cause power bus switching noise. 1- large distance between Power and GND layers in some of the stackups. 2- multiple power and signal layers trying to reference same GND layer
I've been using some reverse build double press stackups for 6-layer boards to allow multiple levels of blind vias allowing good routing on both sides of the board in very cramped designs with high power handling (10 amps in a 32mm dia round pcb). How do you think this holds up vs using a more traditional stackup and adding more layers?
Wow, this is so cool, stackup is really demystified in this video which is the most important and not so easily understandable subject in PCB design I believe. I loved this video and information. May I know your comment on the GND planes being near to power planes from the power integrity perspective, I generally try to keep GND-Power-Power-GND in my stackups. Also in that last stackup (10L, Through hole) how is the Via stub managed i did not see the back drilling in the stack up.
Hi Robert, thanks a lot. I have seen from videos on altium academy about stackups for signal and power integrity to pour power planes and ground planes on alternate layers (in the gaps where the signals if present on a particular layer). So I have seen recommendations like 1. GND/Signals 2. Pwr/signals 3. Solid ground 4. Pwr/Signals 5. Gnd/Signals 6. Pwr/Signals. Would you recommend it?
I also have seen different kind of stackups. The stackups what I use have worked for me and I have had no reason to try anything different. So I do not really have much experience with intentionally mixing planes with signals (unless they didn't fit anywhere else).
I may do some design reviews videos if I see a PCB layout which will be interesting for a video and if I will get permission to make a video about that layout.. PS: I do not have much experience with antennas - just based on design guides.
Has anyone tried the 6-layer stack-up (mentioned in the post) in PCBWay , JLCPCB or some other Chinese online PCB houses? PCBWay or JLCPCB offer another layer stack-up like www.pcbway.com/multi-layer-laminated-structure.html, which has thicker cores between L2/L3 and L4/L5 respectively. I think everyone loves the stack-up mentioned in the post, having thin cores between L2/L3 and L4/L5 respectively, and having thicker prepregs between L3 and L4. This structure offer one more layer for impedance control and better power decoupling. But they told me that this stack-up in fact is a "pseudo" 8 layer stack-up, meaning that the dielectric between L3 and L4 is in fact a thick CORE without copper foil! And this is why this desired stack-up requires higher cost. Any thought about this? Do I understand this correctly? Thank you again for this great video, Robert!
Thank you very much for sharing Robert!!
Stackup is one of the starting points for every new design and extremely important. It can "make or brake" you entire design...
Thank you giannis for leaving your feedback.
Extremely generous Robert! Thank you so much
Nice one Robert. If possible please also provide some suggestions of good reliable multilayer PCB manufacturers especially dealing with blind bias, laser vias, etc. As you know each manufacturer will have their own preferences.
@@jholworld check bittele
Awesome as usual. ❤️....I recommend the channel to many of my peers....also please share some resources to make RF PCB designs too Robert. I would love to see them on the channel. Such a quality content.
Thank you Gudimetla.
Great lesson as always and thank you for sharing RObert. Be safe!
Thank you Edgar. Take care.
Your every video is useful sir. Love from India.
Thank you Tanmay
This was very useful. Thank you.
As a suggestion for a future topic, RF PCB layout in the 1GHz to 10Ghz region would be very helpful. (Perhaps as a collaboration if this is outside your own experience). Topics like inductors, capacitors and microwave filters made of PCB tracks, via stitching in Altium to help shield tracks and form wave guides etc.
That would be an interesting video. However, I would need help with that - I do not really have much experience with RF.
Kudos!!
Thank you for the sharing
Thank you Jack
why should require GND plane after and before Signal layer
Very very nice sir. 👍👍Very informative sir..
Thank you nithya
Thank you so much 👍👍
Why you didnot discussed 4 layer pcb stackup?
if I use 2 Microvia Layers and BuriedVia, is it possible to use staggered and stacked microvias in the same design?
How to design PCB stackup for 6 Layer
SDRAM.SPI.BGA272,BLE Module ,WE-FI Module, Also use TFT with Touch
love it，thanks ！
Thank you zou
MAQUINA FENOMENO
Thanks.
Thank you Kubilay
Hi Robert! I loved your guidelines for > 20Gbps signals video. I am a power electronics designer and always struggled to know how far / how long a loop / when two signals (pwm or analogue ) can cross etc. Any video or book with readily applicable knowledge ?
Thanks for tip. It's not easy to get this kind of info, but when I will have an oportunity, I will make a video about it.
Hello Robert,
Can you please discuss the stackups from power integrity perspective? I am not an expert but I am concerned about 2 things that can cause power bus switching noise.
1- large distance between Power and GND layers in some of the stackups.
2- multiple power and signal layers trying to reference same GND layer
Hello waleed, you are right
1) in 12 layer stackup I do try to have one solid power close to one solid GND
2) I try to avoid this
I've been using some reverse build double press stackups for 6-layer boards to allow multiple levels of blind vias allowing good routing on both sides of the board in very cramped designs with high power handling (10 amps in a 32mm dia round pcb).
How do you think this holds up vs using a more traditional stackup and adding more layers?
Wow, this is so cool, stackup is really demystified in this video which is the most important and not so easily understandable subject in PCB design I believe. I loved this video and information. May I know your comment on the GND planes being near to power planes from the power integrity perspective, I generally try to keep GND-Power-Power-GND in my stackups. Also in that last stackup (10L, Through hole) how is the Via stub managed i did not see the back drilling in the stack up.
Thank you Chethan. Works ok without backdrilling.
Thanx ♥️
Can someone help me about high power(24kW SMPS) PCB stackup?
Hi Robert, thanks a lot. I have seen from videos on altium academy about stackups for signal and power integrity to pour power planes and ground planes on alternate layers (in the gaps where the signals if present on a particular layer). So I have seen recommendations like 1. GND/Signals 2. Pwr/signals 3. Solid ground 4. Pwr/Signals
5. Gnd/Signals 6. Pwr/Signals. Would you recommend it?
I also have seen different kind of stackups. The stackups what I use have worked for me and I have had no reason to try anything different. So I do not really have much experience with intentionally mixing planes with signals (unless they didn't fit anywhere else).
Robert Feranec спасибо за видео! Очень не хватает субтитров! Дайте разрешение на автоматическую генерацию субтитров! Спасибо!
Hello Robert, will you do some more design review submit by your viewers? And I also need some help in pcb antenna design for BLE.
I may do some design reviews videos if I see a PCB layout which will be interesting for a video and if I will get permission to make a video about that layout.. PS: I do not have much experience with antennas - just based on design guides.
what pcb fab is good for these stackups .. i think pcbway doesnt use isola materials ?
We use different PCB manufacturers - the stackups are from www.sqpinternational.com/ www.exceptionpcb.com/ www.gcb.com.hk/
Has anyone tried the 6-layer stack-up (mentioned in the post) in PCBWay , JLCPCB or some other Chinese online PCB houses?
PCBWay or JLCPCB offer another layer stack-up like www.pcbway.com/multi-layer-laminated-structure.html, which has thicker cores between L2/L3 and L4/L5 respectively.
I think everyone loves the stack-up mentioned in the post, having thin cores between L2/L3 and L4/L5 respectively, and having thicker prepregs between L3 and L4. This structure offer one more layer for impedance control and better power decoupling.
But they told me that this stack-up in fact is a "pseudo" 8 layer stack-up, meaning that the dielectric between L3 and L4 is in fact a thick CORE without copper foil!
And this is why this desired stack-up requires higher cost.
Any thought about this? Do I understand this correctly?
Thank you again for this great video, Robert!
Thank you Zhitai. The link doesn't open.
@@RobertFeranec Sorry, Robert. Fixed it!
Hmm, I do not really know. I have not heard anything like this.
Hi sir , How are you?