Precision Machining of a Quartzglass Ring on the DMG MORI ULTRASONIC 50

Precision is key in the processing of advanced semiconductor materials. In this video, witness the intricate process of creating a Quartzglass ring for the semiconductor industry. Key details include:
- Dimensions: Ø 480 x 21 mm
- Material: Quartzglass
The ULTRASONIC 50 machine handles workpieces up to Ø 630 x 500 mm and 300 kg, with a powerful DirectDrive C-axis capable of reaching speeds up to 200 rpm.
Process Integration features for semiconductor manufacturing:
- axialGRINDING
- feedCONTROL
- Assistant Complete
- microdrill
- In-process measuring
Experience complete machining in a single set-up, including inner and outer diameter machining. The 200 rpm DirectDrive C-axis ensures precise grinding, while sub-surface damages are reduced by up to 50%.
Digital Transformation: The CAD/CAM programming is done using Siemens NX CAM, and special ULTRASONIC Technology Cycles enhance efficiency.
Don’t miss this fascinating glimpse into advanced manufacturing techniques!
Learn more about Machining Transformation (MX): transform.dmgmori.com
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How do you handle the processing of advanced materials in your manufacturing processes?