I dont like the idea pressing down to the chip when soldering, there is high risk that you will misplace chip, this method may work for ic with few pins, but if ic has 100+ pins, this may ruins your day
Thank you, don't like this either but using the surface tension seams only reliable working with solder paste not with plain old leaded solder. And sure all pins and the center pads have to been placed straight to the pads, still need more experience for this.
hi, nice display :) I'm also recently making my atmega328 board with QFN32 (MLF?) package and mets problem, with hand solder I yield only 20% programmable (with ISP) and other bricks, I use small-sharp iron set to 300-350'C not sure where's the problem :( the same schematic with friendlier tqfp32 package yields better could it be the flux? or bad random chips from aliX?
Think if you solder them at your temperature range (guess this is for the tip) and don't exceed a few seconds the solder, flux and iron should not be the problem. See maybe Kevin Darrah solder an atmega328.
central pad should have more vias, to better solder (smt line and manual). Second question - try solder central pad from other side. Lead will connect with IC using vias, and You have easier way to connect side pads
Kamil Bystryk Thank you. Unfortunately my design is very limited in size so have to use booth sides for the components. In this case vias are in the way but sure if you have the space will recommend such footprint.
tablatronix Thank you. Tried different methods ... stencil, syringe, toothpick but none is as fast as this method. Sure if you placing on soldering dozen components would use paste and a stencil.
Your voice is identical to Giorgio Moroder! Cool!
Thanks. He seems to be a little older then I.👌
Rossman has a following because he's anti apple, not because he's good at what he does.
one day when I grow up - I want to be able to solder like you can
Raad Yacu I dreaming of the skills of Louis Rossmann. Really worth watching ...
You mentioned Louis, you got my like/subscribe :D
I dont like the idea pressing down to the chip when soldering, there is high risk that you will misplace chip, this method may work for ic with few pins, but if ic has 100+ pins, this may ruins your day
Thank you, don't like this either but using the surface tension seams only reliable working with solder paste not with plain old leaded solder. And sure all pins and the center pads have to been placed straight to the pads, still need more experience for this.
hi, nice display :)
I'm also recently making my atmega328 board with QFN32 (MLF?) package and mets problem,
with hand solder I yield only 20% programmable (with ISP) and other bricks,
I use small-sharp iron set to 300-350'C
not sure where's the problem :(
the same schematic with friendlier tqfp32 package yields better
could it be the flux? or bad random chips from aliX?
Think if you solder them at your temperature range (guess this is for the tip) and don't exceed a few seconds the solder, flux and iron should not be the problem. See maybe Kevin Darrah solder an atmega328.
👏
Ach Ja !
Link for the good flux on aliexpress?
central pad should have more vias, to better solder (smt line and manual).
Second question - try solder central pad from other side. Lead will connect with IC using vias, and You have easier way to connect side pads
Kamil Bystryk Thank you. Unfortunately my design is very limited in size so have to use booth sides for the components. In this case vias are in the way but sure if you have the space will recommend such footprint.
So why hand solder not solder paste reflow?
tablatronix Thank you. Tried different methods ... stencil, syringe, toothpick but none is as fast as this method. Sure if you placing on soldering dozen components would use paste and a stencil.