Die Binding Defect

Die Binding is the tablet compression defect where powder or granules bind with the surface of die during the tablet compression process resulting in production of damaged or rough surface tablets.
The point of occurrence of die binding is the die bore of the compression machine & most common reasons of die binding compression defect are as follows
More moisture content in the product.
Less granules & more fine in final product.
Less concentration of lubricants
Worn out dies & punches
Use of hygroscopic material in the formulation.
Watch the complete video to learn the remedies of the die bore defect
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