[EUVL Part2] ASML EUV Light Source

Welcome to our in-depth exploration of Extreme Ultraviolet Lithography (EUVL) for patterning on silicon wafers in semiconductor fabrication. Over the course of five episodes, we'll delve into every aspect of this revolutionary technology that is reshaping the modern lithography landscape. In this second episode, we focus on the ASML EUV Light Source, a critical challenge in achieving High-Volume Manufacturing (HVM) with EUVL. Below are the main chapters of this video. Click on any timestamp to jump directly to the desired chapter.
Here's what we're uncovering in this tech treasure trove:
1. EUV Light Source: Dive into the heart of the EUV system, where we'll decode the origin of extreme ultraviolet light and its crucial role in nanometer-scale lithography.
[3:05] Major Challenges in Lithography Tools: From ArF to EUV.
[6:15] EUV Source Evolution: From DPP to LPP, and from Xe to Sn fuel.
[12:25] Understanding EUV Radiation: The role of highly ionized Sn atoms.
[17:00] Cymer LPP EUV Source: The core component of the ASML NXE platform.
2. Tin Droplet Generator (DGL): Discover the fine-tuned science behind crafting tiny tin droplets in the EUV light saga.
[21:55] Tin Droplet Generator in Cymer LPP EUV Source: Vessel architecture.
[25:00] DGL Using Piezo Device: Tackling Rayleigh instability.
[27:00] Modulation Techniques: Promoting droplet coalescence to resolve Rayleigh instability and satellite issues.
[31:40] Tin Droplet Coalescence Process: Hybrid waveform optimization (HWO) for a satellite-free region.
[35:20] Droplet Generator Steering System (DGSS): Droplet illumination/detection module and steering system.
[39:10] In-line Refill Droplet Generator (IRDG): Automated refill system to reduce tool downtime.
3. Pre-Pulse Technology (LPP): Zoom in on Laser Produced Plasma (LPP) technology and its pre-pulsing wizardry that amplifies EUV light efficiency.
[41:55] Comprehensive Guide to LPP Pre-Pulse Technology.
[44:25] How LPP Pre-Pulse Technology Works.
[47:50] Roles of Pre-Pulse (PP) & Main-Pulse (MP).
[50:05] Improved Laser to EUV Conversion Efficiency (CE): Using pre-pulse target shaping.
[53:20] Pulse Count Modulation (PCM): Modulating pulse width and power for consistent dosing.
4. Driver CO2 Laser System (DL): Explore the power of CO2 lasers fueling the EUV source, a testament to the relentless pursuit of power and precision.
[57:30] Master Oscillator Power Amplifier (MOPA): Generating CO2 lasers to heat up tin droplets.
[1:00:45] Generation and Amplification of CO2 Laser Pulse.
[1:05:00] Amplification Mechanism of CO2 Lasers.
[1:08:20] Laser Reflection Problem: A significant obstacle to higher power CO2 lasers.
[1:12:05] Seed Isolation Module (SIM): Solutions for the reflection issue.
5. EUV Power Scaling: Trace EUV power scaling from 1W to modern peaks, mapping the future of supercharged EUV systems.
[1:15:15] Light Loss Due to Multiple Mirror Reflections in EUV.
[1:18:25] EUV Power Scaling: How much power is needed, and how can we reach that goal?
[1:21:50] ASML's EUV Power Scaling History: Achieving the 250W target for HVM.
[1:26:10] Power Scaling Beyond 250W: Shorter pre-pulse width, faster droplet, and higher laser power.