WG Tech Demos Vias in Glass Substrates for MicroLEDs

WG Tech can fabricate vias in glass to facilitate microLED production. A pure laser via process cracks the glass, so they use a laser to make a pit, then etch the via. This capability is especially important for seamless tiling of glass-based microLED panels into modules and display systems. That's because interconnection from the front plane to driver chips on the back of the display requires routing connectors over the edge of the glass substrate. While this works, it is very prone to damage. A via would mean no edge metalization reducing costs and increasing reliability.