Great video, Zach! Throughly enjoy this channel as well as hearing all of your insights on RUclips/LinkedIn. As a recent EE grad this type of information is invaluable. For the schematic review portion I also take the time to look at application notes, check some key component values, and look for readability issues (Text overlap, crowded pages, etc.) I agree with your initial statement that requirements and initial engineering design should be reviewed!! Great point. I also think that at each step of the review, verifying that requirements are truly being met by the design is not a bad idea! Thanks again for making all of this information available.
Hi Jonathan, great question! What I can tell you is that the cause of tombstoning is a big temperature mismatch across the ends of the component, where the temperature mismatch causes one side of the component to finish wetting before the other side. So for example, if I route a thin trace on one pad, and then the other pad is connected directly to a big copper pour on the same layer, there might be a risk of tombstoning. So for this you might want to apply a thermal relief to the copper pour. I think R1 would be the main component at risk because you have a trace on one side but large copper region on the other side, so maybe a relief style can be applied on the copper. Assemblers try to overcome the risk by ensuring uniform temperature during reflow. I'll be honest, this is one area where I would send a screenshot to my assembler when finalizing the design. As long as both sides of the component can wet at the same time, then there is less risk of seeing this defect.
Even in schematic there's one more step called netlist check, which if you had done could've avoided that reset trace fiasco. Altium inspector tool highlights the net connections making it easier for this but old school generate netlist in csv and verify manually. About the footprint, i once used one from ultralibrarian and it was wrong but it was too late since i found it after i was soldering the components onto PCB. Had do to bend leads to solder it.
It's been awhile since we created this video so I don't recall everything in the video, but programming/coding could be your embedded application if you are using a processor.
Thanks Zach - helpful as always. Is it possible to export and import design rules across different PCB designs? At the moment I have to copy old PCB designs to preserve design rules. Thanks!
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Great video, Zach! Throughly enjoy this channel as well as hearing all of your insights on RUclips/LinkedIn. As a recent EE grad this type of information is invaluable.
For the schematic review portion I also take the time to look at application notes, check some key component values, and look for readability issues (Text overlap, crowded pages, etc.) I agree with your initial statement that requirements and initial engineering design should be reviewed!! Great point. I also think that at each step of the review, verifying that requirements are truly being met by the design is not a bad idea!
Thanks again for making all of this information available.
Validate Design option in Schematics is also a helpful tool that allows us to see the Warnings and Errors before we move to layout.
11:24 what is the hotkey / shortcut to measure quickly like that?
Ctrl+M and Shift+C to clear the measurements.
@@dmitry.shpakov Thanks so much!
I noticed there were no thermal reliefs for a couple of resistors. Wouldn't that cause tombstoning during the reflow process?
Hi Jonathan, great question! What I can tell you is that the cause of tombstoning is a big temperature mismatch across the ends of the component, where the temperature mismatch causes one side of the component to finish wetting before the other side. So for example, if I route a thin trace on one pad, and then the other pad is connected directly to a big copper pour on the same layer, there might be a risk of tombstoning. So for this you might want to apply a thermal relief to the copper pour. I think R1 would be the main component at risk because you have a trace on one side but large copper region on the other side, so maybe a relief style can be applied on the copper. Assemblers try to overcome the risk by ensuring uniform temperature during reflow. I'll be honest, this is one area where I would send a screenshot to my assembler when finalizing the design.
As long as both sides of the component can wet at the same time, then there is less risk of seeing this defect.
Great video as always Peterson!
What happened to Getting Started with 4-Layer Boards series?
The next parts are coming soon!
Even in schematic there's one more step called netlist check, which if you had done could've avoided that reset trace fiasco. Altium inspector tool highlights the net connections making it easier for this but old school generate netlist in csv and verify manually. About the footprint, i once used one from ultralibrarian and it was wrong but it was too late since i found it after i was soldering the components onto PCB. Had do to bend leads to solder it.
What does mean programming or coding in pcb design..does it related to impedance control matching and ibis models?
It's been awhile since we created this video so I don't recall everything in the video, but programming/coding could be your embedded application if you are using a processor.
Thanks Zach - helpful as always. Is it possible to export and import design rules across different PCB designs? At the moment I have to copy old PCB designs to preserve design rules. Thanks!
Thank you for your valuable knowledge transfer for my request.
So nice of you
Thank you . Really appreciate the knowledge
Glad it was helpful!
Please come impedance matching videos in Altium.
Thank you for those useful tips!
Glad it was helpful!