Not sure I understood the comment/question, but interposers or package substrates are passive in the sense that only host metallization layers to interconnect different components, while active components (transistors) are on the chips. There are active interposers, though, yet they are much more expensive and have the yield problems of "big chips" if you want to cover a sizable area. If my intuition is correct, you are suggesting to have an FPGA (programmable) interposer which could provide similar flexibility than the antennas. Well, yes and no; it is true that the "network" would be reconfigurable in the routing and so on. But the problem persists in the cost of long wires across the interposer or poor broadcast. Hope this solves it or triggers some more discussion! Thanks for the comment.
FPGA interposer/package-substrate?
Not sure I understood the comment/question, but interposers or package substrates are passive in the sense that only host metallization layers to interconnect different components, while active components (transistors) are on the chips. There are active interposers, though, yet they are much more expensive and have the yield problems of "big chips" if you want to cover a sizable area. If my intuition is correct, you are suggesting to have an FPGA (programmable) interposer which could provide similar flexibility than the antennas. Well, yes and no; it is true that the "network" would be reconfigurable in the routing and so on. But the problem persists in the cost of long wires across the interposer or poor broadcast. Hope this solves it or triggers some more discussion! Thanks for the comment.
just wasting your groups funding here