Best Innovations in Ansys Electronics 2021 R1

Biggest Innovations in Ansys Electronics 2021 R1 include:
Ansys HFSS - Fully coupled EM simulation of the largest & most complex systems with new Mesh fusion technology in HFSS
Ansys Icepak - Mechanical thermal solution in Electronics Desktop provides an FEA thermal solution allowing design engineers the ability to get quick thermal insights into a design without any complicated setup and analysis in the same environment.
Ansys EMA3D Cable - Simulate cables in a real life environment with HFSS to EMA3D datalink. You can now simulate sub systems and components (such as antennas and PCBs) with HFSS and bring the field into EMA3D cable easily.
Ansys Maxwell - Slice only simulation technology simulates any 3D complex electric machine geometry in the shortest time and best accuracy.