please continue to make videos! You have the best semiconductor AT videos out there. I would be very interested to learn more about assembly equipment per process. For example, who are the leading suppliers? which models are generally outdated? (Dage 1000 vs 4000, etc)
Hi, can you also do the video explaining the IC packaging molding process and also the lead plating process? This is my humble request. Really appreciate if you can do it. Thank you! Your video helps me a lot! ^^
Very informative. We been using the same technique for one of our Au device. What about for Cu wire sir? Is it capable for the same device? For how many years we are still using the Au wire almost the same example you have shown.
Reverse ball bonding, places a bump on the die pad first. After the bump is formed, a ball bond is placed on the substrate, followed by a stitch bond on the bump. Your presentation places a bump on the substrate first? What’s the purpose of the bump on the substrate when a regular stitch can work?
There's actually no need for a bump if a regular stitch can work. And this is primarily true for a typical leadframe or laminate substrate. However, for SiP or hybrid packaging applications the substrate is not always the typical gold finish (ENIG). This was explained on the slide after the animation you are referring to. The product example on the slide is using a substrate with printed thick film so the surface is not smooth and planar. It also requires a fine pitch capillary because the BPO is small. BSOB works for both reverse and forward bonding. In the old days there is what is called a security bond which is bonding a ball (bump) over a stitch to improve the 2nd bond strength. Thanks for watching the video.
That makes sense. Thanks for the good explanation. Got a question for you. Will BSOB with bump on die and a downbond on the DAP require a bigger BPO than a normal die?
Not necessarily. A larger BPO is always easier to bond. But if the BPO is small you can work around it by using a capillary with small CD. In this way you can form a smaller bump that's just nice when you bond the stitch on top that it won't overhang outside the pad. Then you can set a larger ball for the downbond on DAP.
Hard to tell with the limited information you gave. But here's my input. Is it happening on every strip and localized location on the strip? If it is then it may be the window clamp that is touching the wire when it opens up after bonding and prior indexing or during indexing. If you are using tape to compensate clamping then it is likely to happen when tape is already coming off. And if there is sign of mechanical contact on the wire then check other moving parts after bomding particularly the ejector to output magazine. I hope this helps.
As a recent wirebond process engineer, these videos are very informative and helpful. Thanks for making these!
Always happy to help here
please continue to make videos! You have the best semiconductor AT videos out there. I would be very interested to learn more about assembly equipment per process. For example, who are the leading suppliers? which models are generally outdated? (Dage 1000 vs 4000, etc)
I don't think I will ever work on something remotely related, but it was very interesting nonetheless, so congrats!
worked at kyocera as a process tech in the packaging department wirebonding old technology 😀
Hi, can you also do the video explaining the IC packaging molding process and also the lead plating process? This is my humble request. Really appreciate if you can do it. Thank you! Your video helps me a lot! ^^
Sure I will
Very informative. We been using the same technique for one of our Au device. What about for Cu wire sir? Is it capable for the same device? For how many years we are still using the Au wire almost the same example you have shown.
Reverse ball bonding, places a bump on the die pad first. After the bump is formed, a ball bond is placed on the substrate, followed by a stitch bond on the bump. Your presentation places a bump on the substrate first? What’s the purpose of the bump on the substrate when a regular stitch can work?
There's actually no need for a bump if a regular stitch can work. And this is primarily true for a typical leadframe or laminate substrate. However, for SiP or hybrid packaging applications the substrate is not always the typical gold finish (ENIG). This was explained on the slide after the animation you are referring to. The product example on the slide is using a substrate with printed thick film so the surface is not smooth and planar. It also requires a fine pitch capillary because the BPO is small. BSOB works for both reverse and forward bonding. In the old days there is what is called a security bond which is bonding a ball (bump) over a stitch to improve the 2nd bond strength. Thanks for watching the video.
That makes sense. Thanks for the good explanation. Got a question for you. Will BSOB with bump on die and a downbond on the DAP require a bigger BPO than a normal die?
Not necessarily. A larger BPO is always easier to bond. But if the BPO is small you can work around it by using a capillary with small CD. In this way you can form a smaller bump that's just nice when you bond the stitch on top that it won't overhang outside the pad. Then you can set a larger ball for the downbond on DAP.
Hi. May I know what is the rootcause that the Swing wire short to each other during after complete running, 1 strip found 1 & 2 unit short only.????
Hard to tell with the limited information you gave. But here's my input. Is it happening on every strip and localized location on the strip? If it is then it may be the window clamp that is touching the wire when it opens up after bonding and prior indexing or during indexing. If you are using tape to compensate clamping then it is likely to happen when tape is already coming off. And if there is sign of mechanical contact on the wire then check other moving parts after bomding particularly the ejector to output magazine. I hope this helps.
Pre nalimutan ko na yang wirebonding
Refresh anytime pre
LGALE 🫡