IC DIE pick and place, Wire bonding recorded with high speed camera, by HI-TECH ELECTRONICS

A collection of high-speed camera recording on IC DIE pick and place, Wire bonding, by HI-TECH ELECTRONICS, Volume 1

[@MichaelOfRohan]

Wooowww the wirebonding, the robot bends slack out of the roll to account for the pull and bind from the die. See that zigzag motion?

[@lukedare-white3131]

are those mems microphones?

[@simo9445tsns]

Nice

[@MichaelOfRohan]

Its programmed to recognize that the table jumps at the end of the adhesive place action, and waits for it to settle..
All faster than a blink

[@HighSpeedyouat]

super High-Speed-Imaging Videos