Thermal Stress Analysis with Femap and NX Nastran

This online seminar is intended for inquisitive types that would like to know more about the fundamentals of thermal-stress analysis and how to solve such problems using Femap and NX Nastran. It was presented as an online technical seminar on April 2, 2015.
Thermal-Stress and Thermal-Deflection analyses are an important subset of general finite element analysis (FEA) modeling. Such analyses are common in the development of rocket motors, ASME pressure vessels, electronics (PCB), electronic systems (automotive lamp systems), composite curing mandrels, generators, satellites, etc.
For more Femap & NX Nastran resources, please visit:
appliedcax.com/resources/libr...

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i did a SS heat transfer analsys in FEMAP 11.3.2 with both plate elements and later Hex brick elements. The stresses in the plate elements are a bit weird at it shows peak stresses at strange areas. The hex mesh stresses a more logically distributed. Can you please help me understand why is that so?