Design Integration - Sujit Sharan: Heterogeneous Integration:The Role of Design in Putting the...

Road to Chiplets - Design Integration
Heterogeneous Integration: The Role of Design in Putting the Pieces Together
Sujit Sharan
Intel
Heterogeneous Integration opens an exciting world of possibilities for semiconductor products. There is the promise of product differentiation and the allure of flexibility. Included in this is a mix-and-match product architecture approach that provides immunity to the challenges of Moore’s law and the flexibility to include late-binding product features. These benefits do not come without a price, the challenge is that the interactions between the package architecture and chip complex become increasingly complex and intertwined. If this complexity is not addressed upfront during both die floor planning and package planning and design, the resulting incompatibilities can undo the advantages promised by heterogeneous integration. This talk focuses on the challenges of planning, development and design for effective integration of advanced packaging technologies with heterogeneous die architectures to create high-performing, differentiated, best-in-class products. The role of tools and flows in enabling effective planning and design in an integrated approach, rather than siloed, for both die and package planning will be detailed.