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MEPTEC AI for Semiconductor -

MEPTEC AI for Semiconductor -

MEPTEC AI for Semiconductor -

MEPTEC AI for Semiconductor -

MEPTEC AI for Semiconductor -

MEPTEC AI for Semiconductor -

Novel Techniques for IC Integration and Packaging Using Additive Technologies Patricia Beck NextFlex Flexible Hybrid Electronics (FHE) combines a variety of processes coming from industries such as conventional electronics manufacturing, printing, plastics processing, additive manufacturing, laser imaging and robotic assembly. It combines thinned dies, printed components, flexible, conformal ma...

Metal Gel conductor offers increased durability for hard to soft interfaces in Flexible Hybrid Electronics (FHE) Sai Srinivas Liquid Wire Continuous and real-time monitoring of biopotential and physiological signals is enabled by body-worn electronics, but the adoption of these electronics has been limited because their rigid shape and structure tend to impose restrictions on human body motions...

Retrospective on MEMS packaging - challenges to be considered / chalenges to be solved (market needs) Doug Sparks The evolution of MEMS packaging will be covered, spanning early pressure sensors in the 1960's that used metal TO cans & custom industrial sensors to plastic automotive packaging starting in the 1980s -1990s with pressure, flow, acceleration sensors and gyroscopes. The talk will the...

Packaging of Sensors for High Reliability, Survival and Performance in Extreme Environments Nicholas Tiliakos Innoveering-GE Aerospace Designing sensor packaging for extreme environments (eg. high temperature, oxidizing, high pressure applications) requires understanding the environment and its underlying physics but also accounting for its effects on the sensor’s packaging material selection, ...

Session Overview & Introduction Roger H. Grace Roger Grace Associates

Challenges to Develop a Reliable Lead Free Solder Column To Replace Solder Balls in Large Heterogeneous Packages Martin ("Marty") Hart Topline Corporation Solder balls are well suited for interconnecting normal sized ball-grid array (BGA) components to printed circuit boards (PCB). However, solder balls may be subject to failure (delamination) caused by excessive stresses inherently found in su...

Solving Moore’s law Packaging Challenges Alfed Zinn Kuprion Inc The electronics industry is undergoing a major paradigm shift since Moore’s law has been laid to rest with the last published ITRS in 2016. Shifting from CMOS scaling to a packaging focus allows a continuation of Moore’s law and economic growth for decades to come: continuing miniaturization by cramming more functionality onto a sm...

Enabling high volume data communication - solving the new challenges in PIC wafer testing Tobias Gnausch JENOPTIK · Advanced Photonic Solutions Thanks to Photonic Integrated Circuits (PICs), optics is becoming the key to fast data communication. Although not entirely new, PICs are an important future technology. They are already being used to implement applications such as data transceivers, ge...

Not Just Chips: Silicon Photonics Chiplet Package - Optical Assembly

Not Just Chips: 3D IC Test Strategy

Not Just Chips: Assembly Solutions for Cost Effective Heterogeneous Integration with Disparate...

Not Just Chips: Signal Integrity Analysis at the Dawn of the Interposer Era

Not Just Chips: The Challenges of Scaling Beyond Moore’s Law and Into the World of 3DHI

Bringing sexy back to US heterogeneous integration manufacturing

Outlook for 2023: When and Where Will Growth Return? - Jan Vardaman

How is Industry Uncertainty Impacting MEMS Commercialization: Results of the Annual MEMS...

KGx - Paneldiscussion

KGx - Marc Hutner: Elevating KGD with Deep Data Analytics

KGx - Tom Katsioulas: Component-based supply chain provenance, traceability and digital thread of...

KGx - Jay Rathert: Quality Screening: Concepts and advances for using IC Manufacturing Defect...

Design Integration: Substrate Design Optimization for Chiplet Architecture

Paneldicussion: Design Integration : Current Status and Future Directions

Design Integration: Universal Chiplet Interconnect Express (UCIe)