Back grinding wheel for silicon wafer

Website:morediamondwhe...
Email: [e-mail]
🔸Diameter (mm): D175, D195, D209, D305, D335, etc
🔸Bonded: Vitrified bond, Resin bond
🔸Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
🔸Manufacturing Processes for Silicon Wafers：Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
🔸Applicable Grinding Machine：The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
#backgrindingwheelforsiliconwafer #backgrindingwheel
#grindingwheel #diamondwheel #siliconwaferbackgrinding
#SiliconWafers #backthinning #grindingandfinegrindingofapphireepitaxialwafer #siliconwafer #galliumarsenideandGaNwafer #Vitrifiedbonddiamondwheel #resinwheel #tool #diamondtool