[Eng Sub] Wafer Backgrinding Process: Wafer thinning, Wafer lapping

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  • Опубликовано: 28 окт 2024

Комментарии • 20

  • @matveyshishov
    @matveyshishov Год назад +1

    You're awesome, so clear and with all the details, thank you :) !

  • @CCTV-10
    @CCTV-10 3 года назад +1

    Thanks for your videos that help me a lot to step in this field.

    • @semicontalk3223
      @semicontalk3223  3 года назад

      Thanks for watching and I hope you will have bright future!

  • @arunbk8568
    @arunbk8568 3 года назад +1

    @semicon , Your videos are really usefull to understand the basic concepts.
    Can you please make a detailed video on Backgrinding, and parametrs affecting the Backgrinding process.
    Thanks

    • @semicontalk3223
      @semicontalk3223  3 года назад +1

      Thanks and I will. Please give me some time.

  • @hkn0119
    @hkn0119 Год назад +1

    Hello. Thank you for the Video. Can you also explain about package (strip) grinding process?

    • @semicontalk3223
      @semicontalk3223  Год назад

      Thanks for watching. Strip grinding is a process to remove molded area from molded strip to reduce package thickness. It also can expose die without mold flash means can make exposed die package. Usually it is used for PoP(Package on Package) package technology to minimize package thickness. Precise thickness control, thickness uniformity over the strip, prevention of die crack are important items to check. Please check below video from strip grinding machine supplier, AM Technology, for better understanding.
      ruclips.net/video/PfEh5IYdoWg/видео.html

  • @加藤恵-p5y
    @加藤恵-p5y 3 года назад +2

    50um thick over 300mm diameter? It is so amazing! How can this be done? Won't it break?

    • @semicontalk3223
      @semicontalk3223  3 года назад

      Wafer is mounted on tape during wafer backgrinding process so thin wafer after backgrinding is OK. All the latest technologies make it possible.

    • @加藤恵-p5y
      @加藤恵-p5y 3 года назад +1

      @@semicontalk3223 Thank you for your reply! Anyway, it’s rather challenging since wafer is so fragile.

  • @leechaesung
    @leechaesung 3 года назад +1

    Thank you for your video,
    I really enjoy it , and guess that you were a BG engineer before because of choice of words.
    SHINHAN and EHWA are famous BG wheel company in Korea. But BG world wide machine companies are DISCO and TSK. What process experience do you have?

    • @semicontalk3223
      @semicontalk3223  3 года назад

      Thanks for watching. I have some experience for most of semiconductor fabrication and packaging processes but not enough so just enjoy to study every day to understand more.

  • @MaxPower8921
    @MaxPower8921 3 года назад +1

    Many thanks

  • @jaimepardus
    @jaimepardus 3 года назад +1

    Thanks for the video it helped me a lot! :)

    • @semicontalk3223
      @semicontalk3223  3 года назад

      Thank you and I am glad to hear that it helped you. I will upload more videos as many as possible.

  • @bkoo3472
    @bkoo3472 3 года назад +1

    Hi, can I get a link to the reference of the ScienceDirect?

    • @semicontalk3223
      @semicontalk3223  3 года назад

      I got this image from here.
      www.sciencedirect.com/science/article/abs/pii/S0890695508001089

  • @tedwlynch
    @tedwlynch 2 года назад +1

    請問一下, 有中文的嗎?

    • @semicontalk3223
      @semicontalk3223  2 года назад

      Sorry. I only made English subtitle. I am learning Chinese now but level is very low.

    • @Nchongwei1singapore
      @Nchongwei1singapore 2 года назад

      @semicon talk what are the more complex in wafer backgrinding