@semicon , Your videos are really usefull to understand the basic concepts. Can you please make a detailed video on Backgrinding, and parametrs affecting the Backgrinding process. Thanks
Thanks for watching. Strip grinding is a process to remove molded area from molded strip to reduce package thickness. It also can expose die without mold flash means can make exposed die package. Usually it is used for PoP(Package on Package) package technology to minimize package thickness. Precise thickness control, thickness uniformity over the strip, prevention of die crack are important items to check. Please check below video from strip grinding machine supplier, AM Technology, for better understanding. ruclips.net/video/PfEh5IYdoWg/видео.html
Thank you for your video, I really enjoy it , and guess that you were a BG engineer before because of choice of words. SHINHAN and EHWA are famous BG wheel company in Korea. But BG world wide machine companies are DISCO and TSK. What process experience do you have?
Thanks for watching. I have some experience for most of semiconductor fabrication and packaging processes but not enough so just enjoy to study every day to understand more.
You're awesome, so clear and with all the details, thank you :) !
Thanks for your videos that help me a lot to step in this field.
Thanks for watching and I hope you will have bright future!
@semicon , Your videos are really usefull to understand the basic concepts.
Can you please make a detailed video on Backgrinding, and parametrs affecting the Backgrinding process.
Thanks
Thanks and I will. Please give me some time.
Hello. Thank you for the Video. Can you also explain about package (strip) grinding process?
Thanks for watching. Strip grinding is a process to remove molded area from molded strip to reduce package thickness. It also can expose die without mold flash means can make exposed die package. Usually it is used for PoP(Package on Package) package technology to minimize package thickness. Precise thickness control, thickness uniformity over the strip, prevention of die crack are important items to check. Please check below video from strip grinding machine supplier, AM Technology, for better understanding.
ruclips.net/video/PfEh5IYdoWg/видео.html
50um thick over 300mm diameter? It is so amazing! How can this be done? Won't it break?
Wafer is mounted on tape during wafer backgrinding process so thin wafer after backgrinding is OK. All the latest technologies make it possible.
@@semicontalk3223 Thank you for your reply! Anyway, it’s rather challenging since wafer is so fragile.
Thank you for your video,
I really enjoy it , and guess that you were a BG engineer before because of choice of words.
SHINHAN and EHWA are famous BG wheel company in Korea. But BG world wide machine companies are DISCO and TSK. What process experience do you have?
Thanks for watching. I have some experience for most of semiconductor fabrication and packaging processes but not enough so just enjoy to study every day to understand more.
Many thanks
Thanks for the video it helped me a lot! :)
Thank you and I am glad to hear that it helped you. I will upload more videos as many as possible.
Hi, can I get a link to the reference of the ScienceDirect?
I got this image from here.
www.sciencedirect.com/science/article/abs/pii/S0890695508001089
請問一下, 有中文的嗎?
Sorry. I only made English subtitle. I am learning Chinese now but level is very low.
@semicon talk what are the more complex in wafer backgrinding