Pulsed green laser integration

PCB depaneling using green laser technology, combined with scanning optics, is a cutting-edge method for separating individual circuit boards from larger panels with high precision. Green lasers (usually 532 nm) offer a shorter wavelength, allowing for fine, clean cuts with minimal thermal stress, reducing the risk of damaging sensitive electronic components. The addition of scanning optics enables fast, accurate movement of the laser beam across complex board layouts, ensuring high throughput and precise control.
At EXOM Engineering, we specialize in the integration of scanning optics with laser sources and control electronics, creating advanced solutions for various applications. PCB depaneling using green pulsed lasers (40-200 kHz) is one successful example of this integration. This technology enables precise, non-contact cutting with minimal thermal and mechanical stress, ensuring high-quality results for delicate boards. By leveraging our expertise, we provide custom integration that enhances both performance and efficiency in manufacturing processes, supporting the seamless adoption of laser-based solutions in your operations.
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