WHOOPS! iPhone Microsoldering Gone Wrong
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- Опубликовано: 5 фев 2025
- Let's help Jeff figure out how this one got off track. Support our work by sending us a repair, buying supplies, or coming for training.www.ipadrehab.com
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Very very explanatory thank you.😊
Your son is studying optics? When you go into a bar, and ask for a shott, and the bar man goes to those upside down bottles on a rack, pushes your glass onto a nozzle, that nozzle and the glass above it is known as optics :D
I like it your repairing
hi Jessa, i have issue with iphone 11 always error (10) if i restore with itunes.. i have to split the board and trying flash without bottom board ( baseband board ) but still error (10).. can you help me? thank you Jessa
why do u using hot tweezer instead of a regular iron ?
It’s SO easy for placing the tiny components. Heat both sides at once
Good
Why Apple use some much underfill on iPhone board ? protect from water damage ? Or make board repair much more difficult ?
It seems like a trend from Intel yo M series MacBook's . No water protection in intel vs totally closed boards in M series
These boards have components on both sides. They are assembled by machine in an oven. My understanding is that the bottom chips need to be glued onto the board before they go into the oven. Otherwise, the chips on the bottom would fall off the board because of gravity and won't be soldered.
@@tttuberc you are wrong, glue applied on both sides, and only on some of the components, so this is not a productions issue , but just anti repair issue
@ronlevon4294 ugh what exactly is up, and what exactly is down when the boards is supposed to be handled in a machine with all components placed on both sides by robots BEFORE going into the oven? You think solder paste alone can keep the fine pitch BGA parts in place while moving through conveyor belt? Do you see how careful Jessica has to place and align the PMU before soldering? Also, these glues are what make those crazy drop tests of phones possible.
@@tttuberc if so all chips are other components will be glued and it is not, trust me , I deal with them as well. In MacBook's SSD are glued and SSD controller is not, although it is less that 1cm near one another. drop test is holed by the screws, not by the glue under the chips, glue is mostly for water protection.
@ronlevon4294 I would say it depends on the chip package and how it's assembled and what the physical requirements are that they are glued or not. I have seen some designs at work that chips are glued underneath, some that are not.
Frame flexes in collision in drop test. Flex frame leads to bend board. Bend boad leads to crack and fractures. Just because the board is screwed doesn't mean that it doesn't crack under stress.
I'm with you that Apple has anti repair attitudes and tactics, but this glue is not one of them
Hlw
North ridge fix like patting himself on the back. Then half his videos are selling his business. Sorry
Or him panning around the room talking about how many devices he has to fix 🤦♂
You sound a bit jealous, The guy does well and works long hours like Jess ,If he Pat's himself then he's probably happy he has fix something that's not easy, I like the guy and he shares his time and videos for free ,we all have are quirks. You don't have to watch his channel
Swift is terrible 🤮🤮🤮🤮🤮🤮🤮🤮🤮🤮🤮🤮🤮🤮