SOLIDWORKS Flow Simulation - Thermal Analysis of an Electronics Enclosure

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  • Опубликовано: 5 ноя 2024

Комментарии • 5

  • @pauluk4100
    @pauluk4100 2 года назад

    Hi! What is the default solid? Why you use The Typical ChipArray?

  • @gayantissera6092
    @gayantissera6092 4 года назад

    How to define the TIM for the heat sink?

    • @goengineer
      @goengineer  4 года назад

      You can add a Thermal Interface Material using the Contact Resistance item in the Flow Simulation setup tree.

  • @ghazwanalwan4303
    @ghazwanalwan4303 6 лет назад

    You guys realize that the quality of the video is terrible? Otherwise, it looks good.

    • @goengineer
      @goengineer  6 лет назад

      Thank you for your feedback. We are constantly trying new ways to improve the delivery of our videos.