Thermal Challenges In Advanced Packaging

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  • Опубликовано: 8 сен 2024

Комментарии • 4

  • @andymackie2896
    @andymackie2896 2 года назад +1

    Great overview. DRAM refresh time [f(T)] is the limiting factor for memory on logic. Per discussions at ECTC, photonics will be integrated as the "pentahouse level" in advanced packages, and that will require temperature stability, not just overtemp control. Whether liquid phase cooling of the naked (TIM-free) package will be enough to provide a complete thermal solution remains to be seen.

  • @Brosales1414
    @Brosales1414 3 года назад +2

    Nice! I'm a mechanical engineering student who really wants to get into this!

  • @wertin200
    @wertin200 4 года назад +1

    Nice video, great work

  • @ManojKumar-jw5ys
    @ManojKumar-jw5ys 3 года назад +1

    Thank you sir!!