Intel EMIB Technology Explained

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  • Опубликовано: 25 июл 2021
  • ▶ Learn more from #IntelAccelerated: intel.ly/31KZijL
    Intel's embedded multi-die interconnect bridge (EMIB) is an approach to in-package high-density interconnect of heterogeneous #chips. Instead of using a large silicon interposer typically found in other approaches, #EMIB uses a very small bridge die with multiple routing layers. EMIB #technology leads the industry as the first 2.5D embedded bridge solution.
    #Intel
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