SILCOOL™ TIA282GF Liquid-dispensed Silicone Thermal Pad / Gap Filler

In this video, we introduce SILCOOL TIA282GF, a 2-component, soft, thermally conductive silicone material designed to effectively dissipate heat from electronic devices. With its non-slumping, pasty consistency, TIA282GF provides physical stability for optimized processing. This versatile material serves as a liquid dispensed alternative to pre-fabricated thermal pads, making it suitable for a wide range of thermal designs in electronic applications.
Key Features:
- High thermal conductivity
- Fast curing at low temperatures
- Easy 1:1 mix ratio by weight
- Remains soft after curing, aiding in stress relief during thermal cycling
- Excellent slump resistance, ensuring it stays in place
- Repairable
SILCOOL TIA282GF is ideal as a thermal interface for electronic components in various sectors, including automotive, consumer electronics, telecommunications, lighting, and industrial applications.
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