Electroplating process/Electrodeposition: Corrosion Control

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  • Опубликовано: 30 ноя 2018
  • This video describes the definition of electroplating. It also describes the process of electroplating. Electroplating of copper (Cu) is explained was example. The reactions involved in the process is also explained. The two types of anode cases aware described. The factors influencing the electroplating process is also described. Applications of this process is also discussed.
    Electroplating/Electrodeposition
    You will be able to define electroplating.
    You will be able to describe the process of electroplating with an example.
    You will be able to list out the objectives of electroplating.
    You will be able to discuss the factors affecting electroplating.
    You will be able to enumerate the limitations of this method.
    Electroplating is a process of coating a superior metal over the base metal (inferior metal) by passing direct current through the electrolyte containing the soluble salt of the coating metal.
    Objectives of electroplating
    To improve the corrosion resistance of the metal.
    e.g- chromium and nickel coated components in automotive applications.
    For the aesthetic appearance of the metals/reduce the cost.
    e.g- gold covering ornaments.
    To increase the thermal conductivity of the metal.
    e.g- copper bottomed vessels.
    To increase the tensile strength of the metals.
    e.g- aluminum (Al) coatings.
    Anode Coating metal (Cu) or inert metal
    Cathode Article to be coated
    Electrolyte CuSO4 (solution with soluble salt of coating metal)
    Process (Electroplating of Copper)
    When direct current is passed through CuSO4 (electrolyte), it decomposes to its ions
    At cathode
    Cu2+ ions gets reduced to Cu and gets deposited on the article
    At anode
    Case-I -Anode is the coating metal (Copper)
    Copper gets oxidised to form Cu2+ ions and reacts with SO42-
    Case-II -Anode is the inert metal (Pt, Graphite etc.)
    Electrolyte has to be added to maintain the concentration of CuSO4.
    Factors affecting electroplating
    Temperature - When the temperature increases, ions diffuse faster and the amount of deposition increases.
    Concentration - When the concentration increases, more number of ions are present and the amount of deposition increases.
    Distance between the electrodes - When the distance increases, more energy and time is required for ions to travel and the amount of deposition decreases.
    Time: When the time of electrodeposition increases, the amount of deposition increases.
    Current - When the current supplied is increased, the amount of deposition increases.
    Surface area of the anode - When the surface area of the anode increases, more ions gets dissolved and the amount of deposition increases.
    Disadvantages of electroplating
    Expensive
    Requires electricity
    Time consuming
    Coating may be ununiform
    Electroplating bath solution has to be disposed carefully, as it is prone to water pollution.

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