SiC,Hard Brittle and Composite Wafers Grinder Model R631DF 【SEMICON West 2022】

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  • Опубликовано: 16 сен 2024
  • (1)Ultrasonic spindle type
    (2)Compatible with Various Wafers of Difficult-to-Grind Materials.
    Wafers of Various Hard and Brittle Materials.
    ・SiC, Al2O3, GaN, etc.
    Wafers of Various Composite Materials.
    ・Hard and Brittle Materials + Resin
    ・Resin + Metal
    ・Hard and Brittle Materials + Metal, etc
    Please visit our website.
    www.koyo-machi...
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    #WaferGrinder
    #SiC
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