SiC,Hard Brittle and Composite Wafers Grinder Model R631DF 【SEMICON West 2022】
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- Опубликовано: 16 сен 2024
- (1)Ultrasonic spindle type
(2)Compatible with Various Wafers of Difficult-to-Grind Materials.
Wafers of Various Hard and Brittle Materials.
・SiC, Al2O3, GaN, etc.
Wafers of Various Composite Materials.
・Hard and Brittle Materials + Resin
・Resin + Metal
・Hard and Brittle Materials + Metal, etc
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