MiJing CH3 Mainboard Layered Welding Platform Soldering Devices

MiJing CH3 Mainboard Layered Welding Platform Soldering Devices for iPhone XXSXSMAX refurbishment
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MiJing CH3 Mainboard Layered Welding Platform Soldering Devices for iPhone X/XS/XSMAX refurbishment
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Three-in-one universal iPhone X/XS/XSMAX, support A11 A12 CPU chip, A11 A12 HHD, iPhoneX Baseband, iPhoneXS/XSMAX baseband and glue removal.
Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Brand: MiJing
Size: 185*54*29mm (Main Unit)
Size: 160*88*48mm (Thermostat)
Package Weight: 1.5KG
Voltage: 100-250V
Packing list:
Main Unit *1
Thermostat *1
Power cable *1
Connect cable *1