Bzdura. Everyone who tried this knows that it is so easy only on RUclips movie. What was under this board? What's the hot air temperature? How long it was heated?
@tomekrv942 I use QUICK 957DW+ hot air gun. Removal temp was 400C and solder temp was 380C. It took about 15sec to remove. It depense what kind of components next to it.
If you do want to do drag soldering, why complicate the process? Desolder the component, clean pads, place new component and do the drag soldering straight away.
@@computergeeksrepair Then it's Ok. But in future beware of very fine solder balls. Some paste do have a low surface tension flux in it. When you heat it up without following their instructed temperature curve the balls gets washed away here and there. Some may get lodged into or behind fine pitched IC legs. Immediately you may not locate those during clearing. But later those may get freed and short IC pins.
Hot air temperature is 380 degrees Celcius.😊
Bzdura. Everyone who tried this knows that it is so easy only on RUclips movie. What was under this board? What's the hot air temperature? How long it was heated?
@tomekrv942 I use QUICK 957DW+ hot air gun. Removal temp was 400C and solder temp was 380C. It took about 15sec to remove. It depense what kind of components next to it.
If you do want to do drag soldering, why complicate the process? Desolder the component, clean pads, place new component and do the drag soldering straight away.
I just wanted to try Solder paste.
@@computergeeksrepair
Then it's Ok. But in future beware of very fine solder balls. Some paste do have a low surface tension flux in it. When you heat it up without following their instructed temperature curve the balls gets washed away here and there. Some may get lodged into or behind fine pitched IC legs. Immediately you may not locate those during clearing. But later those may get freed and short IC pins.