Tin Whiskers vs Metal Dendrites

Tin Whiskers Vs. Metal Dendrites: What’s The Difference?
Tin whiskers and metal dendrites are structural formations that appear in tin materials during manufacturing and finishing processes. While metal dendrites have been a long-identified metal fabrication problem, the discovery of tin whiskers came more recently.
To correctly identify tin whiskers vs. metal dendrites, technicians must understand the phenomenon and the best practices for mitigating tin whisker formation. The ability to recognize metal dendrites and tin whiskers is critical during testing and inspection processes.
Tin Whiskers: What Are They And How Do They Form?
At their core, tin whiskers are crystalline structural formations that can occur in pure tin and other pure metals like zinc, cadmium, and silver. The structures can grow to several millimeters long but rarely extend beyond 10 mm.
The crystalline structure of tin whiskers makes them more conductive than the surrounding tin or other metal materials. For example, tin whiskers can form whether or not there is an electromagnetic field present. These strategies may help to reduce the risk of tin whisker formation:
1. When possible, use a tin-lead alloy or another alloy instead of pure tin or zinc.
2. Ensure that tin-plated parts are sufficiently solder-dipped in tin-lead solder.
3. Consider replating areas of a component or product that are particularly likely to develop tin whiskers.
4. Minimize mechanical and physical stress during handling and assembly, as well as during use in the field.
Metal Dendrites: What Are They And How Do They Form?
Metal dendrites have a different shape than tin whiskers. They have a tree-like (dendrite-like) structure of crystalline branches that spread throughout the affected metal. They develop along a surface two-dimensionally rather than growing. These metal dendrites typically appear as molten metal starts to cool and harden.
Using clean printed circuit boards (PCBs), testing for conformal coats on assemblies, and suing UV bumps can also improve the product’s integrity and eliminate the risk of metal dendrite formation
Tin whiskers and metal dendrites can negatively impact the quality of metal products and increase the risk of electronics failures. At SemiPack Services, we specialize in creating
high-quality products that can be made whisker-resistant. We use tin-lead plating because it protects against tin whisker formation better than pure tin and tin alloys with silver.

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Visual examples of the two things would have really helped to explain the difference, just sayin'