iPhone Middle Layer Separation and Reballing Tutorial |
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- Опубликовано: 27 авг 2024
- In this detailed tutorial, learn how to separate and reball the middle layer of an iPhone logic board. This process is crucial for repairing various iPhone models with issues related to the middle layer components. Follow step-by-step instructions and gain valuable insights into:
Tools and equipment needed for safe separation and reballing.
Techniques to carefully remove the middle layer without damaging components.
Cleaning and preparing the middle layer for reballing.
Proper reballing techniques to ensure reliable connections.
Reassembling the iPhone and testing functionality post-reballing.
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