Ceramic is hard material and there are 2 ways to reduce chipping or cracking. 1. Process - Typically we need to reduce feed rate, means reduce sawing speed to minimize chip or crack of ceramic. But it also means sawing will take more time with slow sawing. 2. Blade selection - Resin bond type blade is better than other types blade for hard material like ceramic. Please check another my video for reference and here is the link. ruclips.net/video/klhaPz_bgaY/видео.html
Plasma dicing is a dry etching process using mask. Plasma is applied all areas except areas covered by mask and shape of these areas is flexible. That is the reason it can saw any shape. For laser sawing, laser needs to travel saw street and it is usually strait line. Laser saw is more about reducing mechanical stress on low-k wafer. For saw street width, blade saw (over 60um) > laser saw > plasma dicing (20um or less). Sawing and dicing have same meaning with different expressions.
Nowadays, companies don't use wafer sawing machines, They prefer Lazer machines as I know, but I will get a job which position is sawing part of semiconductor about battery . COULD you give me some advice about this job it is good or not for my Career??
Wafer sawing machine using blade is the most common in semiconductor industry and wafer sawing machine using laser is getting popular but only for advanced Si node wafer. I think semiconductor process engineer is a good position as it is but it depends on which career you want to make.
@@semicontalk3223 honestly, I am still waiting for my interview result. If I pass it I will work at protection module packaging industry at ITM semiconductor company in Vietnam. It means I will make my career like this. Thank for your kindness :)
Hi thanks how to control the backside chipping process? The chipping will cause the crack. But how the chipping how about? If the chipping going inside the die is it consider as out of specs? Go inside the spare zone
Backside chipping can be controlled by sawing blade type, rpm, sawing feed rate. Typically backside chipping is around larger than 250um width is considered as reject.
How do you measure backside chipping ? Turn the wafer behind and use scope to measure 250 um? When you say blade type, do you mean it will affect saw width? Is the blade chosen based on the blade height ? Blade width = 2x blade height ? The width depends on how much the blade goes down the wafer? What about the tape thickness ? Will it affect the saw width cut width ？
Blades for dicing are normally selected by required kerf (if dicing to a pattern), exposure (usable portion of blade, and determined by material thickness and desired cut depth) as well as bond type, grit size, and concentration of diamond.
For the chipping what is the criteria and what is the causes for chipping ? Criteria: cannot go pass the spare zone Causes for chipping : unknown? But chipping can cause crack? So what Ia criteria for crack? Cannot pass the spare zone
For die front side, it is reject if chipping touches die pattern, crosses scribe grid, and seal ring. Yes, chipping can cause crack and chipping is from wrong saw blade type or wrong process parameters.
![[Eng Sub] Blade Sawing - Blade type, Hub type, Hubless type, Process Parameters](http://i.ytimg.com/vi/klhaPz_bgaY/mqdefault.jpg)
![[Eng Sub] Package Reliability Test](/img/1.gif)
Hi thanks for you good sharing... I need advice.. how to avoid chip/crack part after sawing,we saw ceramic..thnks
Ceramic is hard material and there are 2 ways to reduce chipping or cracking.
1. Process - Typically we need to reduce feed rate, means reduce sawing speed to minimize chip or crack of ceramic. But it also means sawing will take more time with slow sawing.
2. Blade selection - Resin bond type blade is better than other types blade for hard material like ceramic.
Please check another my video for reference and here is the link.
ruclips.net/video/klhaPz_bgaY/видео.html
Thank you very much! Why can plasma dicing saw any shape but laser cannot? Also what is the standard saw street width (um) for each methods?
Plasma dicing is a dry etching process using mask. Plasma is applied all areas except areas covered by mask and shape of these areas is flexible. That is the reason it can saw any shape.
For laser sawing, laser needs to travel saw street and it is usually strait line. Laser saw is more about reducing mechanical stress on low-k wafer.
For saw street width, blade saw (over 60um) > laser saw > plasma dicing (20um or less). Sawing and dicing have same meaning with different expressions.
I work every day on Disco Saw equipment.!
Nowadays, companies don't use wafer sawing machines, They prefer Lazer machines as I know, but I will get a job which position is sawing part of semiconductor about battery . COULD you give me some advice about this job it is good or not for my Career??
Wafer sawing machine using blade is the most common in semiconductor industry and wafer sawing machine using laser is getting popular but only for advanced Si node wafer.
I think semiconductor process engineer is a good position as it is but it depends on which career you want to make.
@@semicontalk3223 honestly, I am still waiting for my interview result. If I pass it I will work at protection module packaging industry at ITM semiconductor company in Vietnam. It means I will make my career like this. Thank for your kindness :)
Hi thanks how to control the backside chipping process? The chipping will cause the crack. But how the chipping how about?
If the chipping going inside the die is it consider as out of specs? Go inside the spare zone
Backside chipping can be controlled by sawing blade type, rpm, sawing feed rate.
Typically backside chipping is around larger than 250um width is considered as reject.
@@semicontalk3223 you mean we can reduce the speed feed rate and increase rpm?
How do you measure backside chipping ? Turn the wafer behind and use scope to measure 250 um?
When you say blade type, do you mean it will affect saw width?
Is the blade chosen based on the blade height ?
Blade width = 2x blade height ? The width depends on how much the blade goes down the wafer? What about the tape thickness ? Will it affect the saw width cut width ？
Blades for dicing are normally selected by required kerf (if dicing to a pattern), exposure (usable portion of blade, and determined by material thickness and desired cut depth) as well as bond type, grit size, and concentration of diamond.
Thanks for good comment!
How much the blade cut into the tape ?
Good background knowledge, thanks for the video. All the best, keep doing more videos!
awesome presentation. thanks.
For the chipping what is the criteria and what is the causes for chipping ?
Criteria: cannot go pass the spare zone
Causes for chipping : unknown?
But chipping can cause crack?
So what Ia criteria for crack? Cannot pass the spare zone
For die front side, it is reject if chipping touches die pattern, crosses scribe grid, and seal ring.
Yes, chipping can cause crack and chipping is from wrong saw blade type or wrong process parameters.
Wrong saw parameters means wrong sawing blade type, rpm, sawing feed rate?
If the feed speed is too fast , so more backside chipping. Can we reduce the speed? How much is the feedspeed then?
@@Chongweisingapore I think it will be better to make another episode to answer for your questions. Please give me some time to prepare.