This worked on two V10s back to back enough to copy files off etc. Will report back after a few weeks or if it fails. First one went easy on the heat and was cautious, ~2.5 setting out of 10 (air) on an 878DD solder station, 100°c for 2 minutes then 300° (allowing for ramp) total time at 300° 1 minute. Used normal bog standard flux that I cleaned off after. It is neutral PH so probably fine but prefer to make it clean. Second phone I used setting of 3/10 air for little more heat and maybe 10 seconds longer. No damage to PCB, all silk screening on chips still so there were no thermal issues. Didn't use the adaptor tips just the standard wide one. Used Isoprop and a soft toothbrush to clean the flux off. Waited till flux mostly set in order to not dislodge small parts while hot or thermal shock the board with iso hitting it. Had a bottle cap over the components to right of CPU and below the flash just in case (have seen some use this trick with a metal pad). Looks like my phone had been reflowed before in past and poorly cleaned with a melted lip rolled up on the ram chip (where they have obviously blasted the CPU) - lasted about 2 years though so... can't be too bad of a job. Thanks so much!!!! Copying all data off right now and it's working fine :) Cheers\ EDIT as of 2 weeks it's dead again. Will do a temp fix again while waiting for note 3 BGA stencils to arrive ;) Back up and running. Phone wasn't as hot so pretty sure it was the flash chip so gave it extra attention/heat. Seems good for now. 1st phone (done with slightly lower temp) still working though.
This is the exact same steps I arrived at independently. Low heat for 2 min then 300 C for 1 min. However all LG G4 phones which I "fixed" using this method soon failed afterwards. So this is not really permanent fix. Probably need to scrape off defective epoxy underfill and reball the ram chip with good leaded solder for permanent fix.
did this with a heat gun, working so far. I used no flux, as it looked like there was a lot there already. I would not recommend using a heat gun though, unless you have nothing to lose. reflow gun would be ideal.
Is the no clean flux a permanent fix? I really want to give my V10 life again. There was so much on that phone that I wasn't able to back up before it abruptly shut down so I really want to get it going again.
No it's not permanent fix. Bootloop issue is due to defective epoxy underfill, so you need to desolder ram chip, scrape off defective underfill, reball/resolder the ram chip with good leaded solder.
No hair dryer is not hot enough to reflow unleaded solder. Hair dryer sometimes works as temp repair though because it can soften epoxy underfill and allow cracked solder balls to rejoin temporarily. Cheap hot air rework station 858D is only $35 online. Well worth getting for your hobby even if not for fixing LG V10.
@@springer-qb4dv I try with paint heat gun. It work on my old V10. But only work for a day. And same problem occurs. However. I have many Toshiba Lab Top all have the same issues. Will this technique fix the problem? I did not even apply solder oil. I assume solder oil will help solider flow to all places. Correct ?
@@kaye2890 soldering flux will only help if there is no underfill. In case of many laptop chips, flux will help since there is no underfill. In case of LG V10/G4, there is epoxy underill, so flux is not much use. Note that with laptop, just reflowing the chip could bring it back for months if not years. However, for LG V10/G4, reflowing even with hot air station will be only temporray fix due to epoxy underfill. Only permanent solution is to desolder the ram chip and scrape out the underfill and reball/resolder. There are good videos showing how this is done on youtube.
No, this works as shown. You can revive many dead LG V10/G4 by heating as shown in video. However, it is still probably only short term fix as phone will go back to bootloop soon.
This worked on two V10s back to back enough to copy files off etc. Will report back after a few weeks or if it fails.
First one went easy on the heat and was cautious, ~2.5 setting out of 10 (air) on an 878DD solder station, 100°c for 2 minutes then 300° (allowing for ramp) total time at 300° 1 minute. Used normal bog standard flux that I cleaned off after. It is neutral PH so probably fine but prefer to make it clean.
Second phone I used setting of 3/10 air for little more heat and maybe 10 seconds longer. No damage to PCB, all silk screening on chips still so there were no thermal issues.
Didn't use the adaptor tips just the standard wide one.
Used Isoprop and a soft toothbrush to clean the flux off. Waited till flux mostly set in order to not dislodge small parts while hot or thermal shock the board with iso hitting it.
Had a bottle cap over the components to right of CPU and below the flash just in case (have seen some use this trick with a metal pad).
Looks like my phone had been reflowed before in past and poorly cleaned with a melted lip rolled up on the ram chip (where they have obviously blasted the CPU) - lasted about 2 years though so... can't be too bad of a job.
Thanks so much!!!! Copying all data off right now and it's working fine :) Cheers\
EDIT as of 2 weeks it's dead again. Will do a temp fix again while waiting for note 3 BGA stencils to arrive ;)
Back up and running. Phone wasn't as hot so pretty sure it was the flash chip so gave it extra attention/heat. Seems good for now.
1st phone (done with slightly lower temp) still working though.
It worked for me with a hair dryer, had to do it two times but it was more than enough to remove the pictures from it. Thanks.
where to buy that flux pen
This is the exact same steps I arrived at independently. Low heat for 2 min then 300 C for 1 min. However all LG G4 phones which I "fixed" using this method soon failed afterwards. So this is not really permanent fix. Probably need to scrape off defective epoxy underfill and reball the ram chip with good leaded solder for permanent fix.
Exactly what was needed. Phone came on immediately
I did mine with a hair dryer for 30 mins at medium heat. It's all working now but need to add copper film tape to cover the big IC.
did this with a heat gun, working so far. I used no flux, as it looked like there was a lot there already. I would not recommend using a heat gun though, unless you have nothing to lose. reflow gun would be ideal.
back to non working again the next day. I will try this one more time.
Is the no clean flux a permanent fix? I really want to give my V10 life again. There was so much on that phone that I wasn't able to back up before it abruptly shut down so I really want to get it going again.
No it's not permanent fix. Bootloop issue is due to defective epoxy underfill, so you need to desolder ram chip, scrape off defective underfill, reball/resolder the ram chip with good leaded solder.
do we need to press chip while heating
this isn't an LG V10 that I have. I have 14 screws and there are only 12. the heat covers are different. which model of phone is this?
Dual sim
Can you give a link to clean flux pen? Thanks!
Shit worked like a champ, you get an upvote
What is flux?
I have 3 lg v10. All not booting up nor charging
Thanks for the video, you forgot the step "Cooling before put it all back together"
Hey Eric do you repair LG V 10 Phones ?
Can i Use Soldering paste? Instead of no clean flux?
soldering paste with lead solder? No. Just plain soldering flux
I was wondering if hair dryer is hot enough for this application? I don't have expense tool as you shown.
No hair dryer is not hot enough to reflow unleaded solder. Hair dryer sometimes works as temp repair though because it can soften epoxy underfill and allow cracked solder balls to rejoin temporarily. Cheap hot air rework station 858D is only $35 online. Well worth getting for your hobby even if not for fixing LG V10.
@@springer-qb4dv
I try with paint heat gun.
It work on my old V10. But only work for a day. And same problem occurs.
However. I have many Toshiba Lab Top all have the same issues.
Will this technique fix the problem?
I did not even apply solder oil. I assume solder oil will help solider flow to all places.
Correct ?
@@kaye2890 soldering flux will only help if there is no underfill. In case of many laptop chips, flux will help since there is no underfill. In case of LG V10/G4, there is epoxy underill, so flux is not much use. Note that with laptop, just reflowing the chip could bring it back for months if not years. However, for LG V10/G4, reflowing even with hot air station will be only temporray fix due to epoxy underfill. Only permanent solution is to desolder the ram chip and scrape out the underfill and reball/resolder. There are good videos showing how this is done on youtube.
Thanks. This video could have about 3 minutes. Good work though.
Cee Dee nice update...keep it up
Like a fine wine, things should not be rushed. And the music score rocked the progress and the outcome. Simply enjoy the flow...
Worked perfectly. Thanks !
300 degree is way too high, my Chip fucked up by doing it for 30 sec.
I HAVE TO TRY THIS since é year my LGv10 IS in recycle bin
My Lg V10 is the same problem. Not turning on. Where do u live in?
what about air flow settings
Set it to 2.5 or 3 to minimize heat to other components. But this is still only temporary fix.
hi friend it work tanx alot i from ethiopia
Thank You!
Very nice👍
Thanks! Very useful video.
this video is very helpful
شكرا
Love you brother !!!!
Haha maybe it's work. But to calm it easy fix??? Ammm
You change the mother board . ... lying
No, this works as shown. You can revive many dead LG V10/G4 by heating as shown in video. However, it is still probably only short term fix as phone will go back to bootloop soon.