Highcon at Schumacher 75th (full version)

Schumacher Packaging Group Marks 75th Anniversary and Embraces the Future of Packaging. The commemorative event in Cologne, Germany, held under the theme “Unboxing the Future of Packaging” highlighted the Group’s rich history and future, filled with innovative possibilities and sustainable packaging solutions.
At the event, Shlomo Nimrodi, CEO of Highcon, took the stage to discuss the innovative and sustainable advantages of Highcon’s digital finishing technology. Nimrodi emphasized Highcon’s strong partnership with Schumacher and the groundbreaking capabilities of the Highcon Beam digital cutting and creasing system, installed at Schumacher Packaging & Display in Breda and more than 70 customers worldwide including Westrock, Pratt, THIMM and many others.