Lecture 39 (CHE 323) Lithography Process Overview

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  • Опубликовано: 6 ноя 2024

Комментарии • 8

  • @黄晓晟
    @黄晓晟 5 лет назад +5

    Q1: reproduce the pattern CD required; transparent to the laser beam to expose the photoresist; good adhesion of photoresist to substarte; low cost; envioronment friendly...
    Q2: photo, can be removed by the developer; resist, resist to the etching
    Q3: The adhesion promoter is a kind of vapor that can quickly adhere to the silica surface, so that the H2O has no place to adhere
    Q4: edge bead exists in the edge of the waver, it occurs because the direcion of the surface tension changes from vertical direciton to horizontal
    Q5: removing the solvent that used to remove the particles and contaminants.
    Q6: positive photoresist: the part exposed to the light will be removed by developer; negative photoresist...

  • @shepherdsambaza8744
    @shepherdsambaza8744 3 года назад +2

    Thank you for the informative video, Prof!

  • @deepraj1231
    @deepraj1231 8 лет назад +3

    Thanks a lot for posting these lectures, indeed very helpful.

  • @ChrisMack
    @ChrisMack  10 лет назад +4

    A PDFcopy of all the slides in this course are available at:
    www.lithoguru.com/scientist/CHE323/course.html

  • @071973ful
    @071973ful 8 лет назад +2

    Thank you professor for very informative information

  • @monanafari5050
    @monanafari5050 5 лет назад +1

    amazing videos!!!

  • @yongxianglim56
    @yongxianglim56 8 лет назад +2

    Thank you so much for this video! It was very informative

  • @mohammedhasan6522
    @mohammedhasan6522 10 лет назад

    is there any possibility to get the slides ? it is very helpfull