【Silicon Wafer Grinder】 Model DXSG320 JTEKT MACHINE SYSTEMS

A grinding machine that realizes high-precision planarization of silicon wafers with "double-sided simultaneous grinding".
・This is an overwhelming advantage over lapping machines in terms of accuracy, environmental friendliness, and running cost.
・Initial investment in the planarization process of silicon wafer production lines
　and "replacements for rap machine"　
We recommend the DXSG320 silicon wafer grinder.
・The DXSG320 can simultaneously grind both sides of a wafer, and the DXSG320 is capable of grinding one wafer at a time.
・The DXSG320 is capable of grinding data traceability for each wafer.
・The DXSG320 is OHT compatible.
Our website also introduces the R631DF, a grinding machine for compound semiconductor wafers, hard and brittle materials, and composite materials.
The R631DF is capable of angle correction of crystal orientation.
Please visit our website.
www.machine.jt...
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