StencilQuik for rework of Ball Grid Arrays (BGA) - standard procedure in IPC 7711 5.7.2

Whether you are using paste flux or solder paste StencilQuik™ BGA rework stencil greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs.
These flexible solder paste BGA rework stencils remain in place on the site location becoming an integral part of the PCB assembly. StencilQuik™ is manufactured from a polyimide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process. These BGA stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
The StencilQuik(TM) stay in place BGA rework stencil is something you can rely on. It is part of the IPC 7711 BGA rework processes. There have been numerous reliability studies which have been proven the StencilQuik(TM) rework stencil dependable. See copies of the studies here and here. In addition a 3rd party has independently verified that the SIR characteristics of a BGA with a StencilQuik(TM) placed using the stencil with paste and paste flux have more than acceptable SIR (surface insulation resistance) values when placed onto a PCB.
More on the process here:
www.solder.net...

[@Vitalii-R.]

In a real practice people don't use a stencil for a solder paste if the pads are tinned.