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Surface Mount Process
Великобритания
Добавлен 10 ноя 2013
www.surfacemountprocess.com/ - This channel has been created primarily to be a technical resource for surface mount process engineers but also for anyone with an interest in surface mount technology (SMT). The scope of the channel will be all aspects of the manufacturing process from solder paste printing, component placement, reflow soldering through to automatic optical inspection (AOI) - www.surfacemountprocess.com/
01005 Hand soldering and Rework using solder paste and hot air
01005 Hand soldering and Rework - Apply type 4 solder paste to component pads using fine tool, place 01005 component using flux-tipped fine tool, heat PCB using bottomside heater and solder component using low velocity, hot air rework tool.
Просмотров: 313
Видео
StikNPeel to simplify solder paste application during QFP rework
Просмотров 1492 месяца назад
The StikNPeel ™ process greatly simplifies the ability of a rework or an assembly technician to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel ™ onto the PCB sliding it on/around until the apertures are aligned over the pads. The StikNPeel(TM) stencil features a repositionable adhesive backing which makes it unique. Solder paste is t...
StencilQuik for rework of Ball Grid Arrays (BGA) - standard procedure in IPC 7711 5.7.2
Просмотров 2562 месяца назад
Whether you are using paste flux or solder paste StencilQuik™ BGA rework stencil greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs. These flexible solder paste BGA rework stencils remain in place on the site location becoming an integ...
EZReball for Ball Grid Arrays (BGA) - recognized in IPC 7711/21 Procedure 5.7.6.
Просмотров 1532 месяца назад
The BEST EZReball™ process is an answer to your reballing problems. In fact it is recognized in IPC 7711/21 Procedure 5.7.6. as one of the ways to reball a BGA. It allows for better yields and faster reballing times. The simple nature of the EZReball™ BGA Reballing process allows even the beginning repair technician to reliably and quickly replace balls on a BGA package. Alignment is simple wit...
Spot the difference - New Year's challenge - Surface Mount Process
Просмотров 8598 месяцев назад
Just a bit of New Year fun :) Five images of surface mount assemblies each with eight differences. Can you find them all before the timer runs out?!? www.surfacemountprocess.com
PCB inline aqueous spray-in-air cleaning
Просмотров 24611 месяцев назад
When it comes to choosing which machine to select for a given process, again it depends what needs to be cleaned and what residues need to be removed, but also the required throughput. If the throughput is high with few different products, inline systems are generally chosen but the initial investment will be relatively high, along with the running costs of energy, chemistry and deionised water.
Pin-in-Paste - Connector drop during Intrusive Reflow
Просмотров 3,2 тыс.11 месяцев назад
Pin-in-Paste (PiP) or intrusive reflow is a soldering process used in electronics manufacturing to attach through-hole components to a printed circuit board (PCB) that has predominantly surface-mounted components. This process allows through-hole components, such as connectors, switches, or some specialized components, to be soldered using reflow soldering rather than traditional wave soldering...
Solder Wetting of Surface Mount IC during Reflow Soldering
Просмотров 1,5 тыс.11 месяцев назад
Solder wetting in surface mount soldering refers to the desirable process by which molten solder adheres and spreads evenly over the surfaces of the solderable components (such as component leads or terminations) and the corresponding pads on the printed circuit board (PCB) during the soldering process. Proper solder wetting is crucial for creating reliable, strong, and durable solder joints in...
Surface Mount IC Lifted Lead Coplanarity Fault during Reflow Soldering
Просмотров 1 тыс.11 месяцев назад
Surface Mount IC component lifted lead or coplanarity issues refer to a situation where the leads or terminals of a surface mount component (SMC) are not flat and not soldered to the PCB pads during reflow soldering. This lack of coplanarity can result in various problems, including poor solder joints, electrical connectivity issues, and mechanical stress on the component. To ensure the coplana...
Component Placement - Package On Package (PoP)
Просмотров 99211 месяцев назад
Component Placement - Package on Package (PoP) is an advanced semiconductor packaging technology used in electronics manufacturing, especially in the design of integrated circuits (ICs) and microchips. PoP involves stacking one semiconductor package on top of another, allowing multiple chips to be vertically integrated within a single package. This technology is commonly used in mobile devices,...
Conformal coating of SMT PCBA using automated selective spray machine process
Просмотров 44711 месяцев назад
Conformal coating of SMT PCBA using automated selective spray machine process www.surfacemountprocess.com/
Electrochemical Migration (ECM) - Dendrite formation / Dendritic growth
Просмотров 2,6 тыс.Год назад
Electrochemical Migration (ECM) - Dendrite formation / Dendritic growth
Moisture Sensitivity Level (MSL) - Destructive PCB delamination test
Просмотров 3,1 тыс.2 года назад
Moisture Sensitivity Level (MSL) - Destructive PCB delamination test
SMD Component Placement - 240 pin QFP at the end of the video
Просмотров 2,7 тыс.2 года назад
SMD Component Placement - 240 pin QFP at the end of the video
Ball Grid Array (BGA) rework - Removal and refit using hot air and flux
Просмотров 26 тыс.2 года назад
Ball Grid Array (BGA) rework - Removal and refit using hot air and flux
Hand soldering surface mount QFP with solder paste and hot air tool to reflow
Просмотров 9522 года назад
Hand soldering surface mount QFP with solder paste and hot air tool to reflow
Moisture Sensitivity Level (MSL) for hygroscopic surface mount components
Просмотров 2,4 тыс.2 года назад
Moisture Sensitivity Level (MSL) for hygroscopic surface mount components
10 solder paste printing process defects and solutions - under 3 mins!
Просмотров 25 тыс.2 года назад
10 solder paste printing process defects and solutions - under 3 mins!
Hand soldering surface mount components to IPC class 3
Просмотров 26 тыс.2 года назад
Hand soldering surface mount components to IPC class 3
Replacing surface mount SOIC - SMT rework made simple and easy
Просмотров 2482 года назад
Replacing surface mount SOIC - SMT rework made simple and easy
Professional hand soldering surface mount IC's to IPC class 3 - Drag/sweep soldering using flux gel
Просмотров 8 тыс.2 года назад
Professional hand soldering surface mount IC's to IPC class 3 - Drag/sweep soldering using flux gel
Using flux gel, iron with chisel tip and tinned copper wire to remove surface mount components
Просмотров 2,4 тыс.2 года назад
Using flux gel, iron with chisel tip and tinned copper wire to remove surface mount components
Surface Mount Component removal techniques using flux gel
Просмотров 3,8 тыс.2 года назад
Surface Mount Component removal techniques using flux gel
Surface Mount Process - paste printing/inspection, component placement, reflow soldering & 3D AOI
Просмотров 26 тыс.2 года назад
Surface Mount Process - paste printing/inspection, component placement, reflow soldering & 3D AOI
Surface Mount Troubleshooting Guide - solder paste printing, component placement & reflow soldering
Просмотров 5 тыс.2 года назад
Surface Mount Troubleshooting Guide - solder paste printing, component placement & reflow soldering
Solder Paste Inspection Process - 3D SPI
Просмотров 4,2 тыс.2 года назад
Solder Paste Inspection Process - 3D SPI
ERSA Versaflow 3/45 - Selective Solder Process
Просмотров 3,1 тыс.2 года назад
ERSA Versaflow 3/45 - Selective Solder Process
Reflow of surface mount gull wing device - Heel and toe fillet
Просмотров 8372 года назад
Reflow of surface mount gull wing device - Heel and toe fillet
BGA reflow soldering process double drop using lead-free solder and RoHS compliant component
Просмотров 8 тыс.2 года назад
BGA reflow soldering process double drop using lead-free solder and RoHS compliant component
Mid chip solder ball or bead forming under SMT resistor during reflow soldering
Просмотров 9 тыс.2 года назад
Mid chip solder ball or bead forming under SMT resistor during reflow soldering