The Next Big Wave in Chip Design. TSMC's WoW Packaging
HTML-код
- Опубликовано: 27 сен 2024
- In this video I discuss 3D microchips which will keep Moore's law going
#3Dmicrochips
***
➞ Support me on Patreon: / anastasiintech
➞ Subscribe for new videos every week ! ❤ And leave me a comment below!
Let me know what you think!
can you make a video when we are going to have 100 times more cpu and gpu performance
and how
Always find funny when they try to wow effect with new terminology.
They are already 3D ;) but to one of your point, I think heat is a major factor.
I could argue, semantically, that the future is 2D+1D.
A 2D layout could maybe profit of quantum behaviors, efficiency, lower heat, density…
And integrate vertical, 1D to the next layer, that could be a heat transfer, nanotubes are really good at that in 1D direction:)
Always great to see the new technologies you see coming in the field! So Tesla’s dojo chips are going to be taking advantage of some of these new processes. Very interesting. I remember seeing the power and cooling being vertically integrated but I did not realize others were designing so much in vertical integration. It all seems obvious when you present it… of course! stick the memory on top and reduce the latency that way! Lol, but I am sure the complications of HOW to do it must be crazy hard to crack. Those different bonding styles and materials being used to allow the chip to chip communication and how to cool it all.. it’s wild 🤪. Nice to see Moore’s law always finds a way forward
The 🎄 looks great! Happy Holidays!
Plz make a video on photonics
Can you please make a video about Silicon Photonics and chips build on photonic technology? Great video as always. Рад видеть что есть видео на такие топики в Ютубе.
Thank you so much for taking the time to explain how computing will be handled in the future.
What I think...the ultra complicated controls of spacecraft will be needing massive computing in an efficient, small, light weight package. Power consumption is already an issue with electric automobiles, and upcoming autonomous vehicles are going to require a huge amount of computation, so these developments are going to become more and more important in the next few years. Thanks again!
Your videos are such a treat. I learn so much from them. Thank you! I would love to see a video about the manufacturing process of modern chips. The machines used and a breakdown of the process and such.
Happy to hear! You may like to check out this one: ruclips.net/video/Gi2wkQAWzQM/видео.html
I remember when I was a computer engineering student years ago, people used to talk about the end of Moore's Law. And I asked, why not to stack chips together? Now it's happening!
because the energy consumption will increase the more chips you add
One should also recall that in the Terminator film franchise, the prop model of the T-101’s chip was purposely made to look as though composed of a number of cubes -- a prop artistically inspired by thinking about hypercubes. This inevitably gives the impression that data does move up and down within the fictional computer chip, which would qualify the fictional device as a 3D chip similar to those you describe here.
This is amazing, background video snippets and info!
Besides heat dissipation question, I'd like to know more about the layers are aligned. I think it's mind blowing that you can align the interconnects when the density of the connection points is so high.
On a chip with tens of millions of transistors, there are only about 1000 connectors. The connectors a so much bigger than the transistors that it is not a big problem with stacking. The heat is a way bigger problem.
TSMC is working on on chip liquid cooling via very small channels
@@onlymediumsteak9005 That could actually work. but if you cant shrink more the power usage will be about 10-15 watt per layer. so the power will go above 100 watt soon. its not doubled unlimeted.
@@onlymediumsteak9005 thas exactly how you do it like in engine blocks and heads with cooling channels
@@erkinalp Yes. But the chemical Insertion reaction can only be applied on a waver with a light source that is not available and never will be because the wavelengths are too small. Wavelengths are much larger than a single atom. They already struggle with the wavelengths now. They use water drops to compress them now bit, but there is no idea yet how to scale that down by some magnitudes needed for your idea. Then there is another insertion method, but that method is way too slow. To insert all the atoms, you require many many years to insert them all for just 1 processor. The process is just too slow and needs, if you calculate it by the same more's law, a few decades at least to develop. Good thought anyway. Thanx for posting.
Such a nice way to keep up with the latest tech news with Anastasia and her beautiful voice.
So interesting:) But arent there issues with Heat dissipation?? I suppose the "lower" layers of the chip would be harder to cool? And btw the trees look great haha
I have the same doubt
I think they will be designed much like dojo where you have heat sinks and or cooling between levels. You can also run a coolant pipe vertically down the center of all chips and place compute chips there and the low temp items around the outside of the SoC.
May go to silicon carbide semiconductor instead of silicon.
I remember seeing something fairly recently that was being done as part of a research project where they were putting cooling channels directly into the silicon dies. Think of how the water channels work inside a water block... But just imagine it inside special non-conductice layers inside the silicon itself. This would work really well and can work with multiple layers much like how they connect using TSVs.
Linus actually talked about it here... ruclips.net/video/YdUgHxxVZcU/видео.html - this was the video I mentioned in my previous comment. I'm sure it should be fairly trivial to make this work in 3D early enough. The heat dissipation is massive.
Great video. Would be interesting to see a video on photonics and its industrial use cases as well as its potential in the consumer market in the coming decade. Cheers
Plz make a video on the topic of photonics
+1 for photonics :)
What an intense industry to be in. And interesting. BTW, your links didn't show up on my youtube. Might me my computer but JIC it helps.
I will never be able to forget that beautiful voice now, hope you are proud of you Anastasi :(
Have a great week ahead and keep it up the great job
Super interesting! I find it difficult to be certain about the future direction. One theme is clearly these 3d chips, possibly at some point with liquid cooling as used in some of the Cray supercomputers, another theme is neuromorphic chips that circumvent many of the heat extraction troubles, by not having a clock and operate like human brains, another theme is quantum computing. It may be that all these themes and possibly others I don't know of have applications and all have long future developmental time lines. Then there is the limit of atomic size with a silicon atom being approximately 0.2 nm, so that a 2 nm track is now about 10 atoms wide and presumably can not get ever get below one atom. This is the current limit of electron microscopes. All of these things point towards an end of Moore's law in the next few years, or am I missing something? Loved the background Christmas tree. Hope your Tesla car is like new now. Thanks for sharing!
Good point. The heat problem always raises its ugly head sooner or later. LOL
Excellent video. I learn so much from you!!
I love your knowledge, thanks a lot !
Stacking chips certainly seems a logical step forward, but the most important issue is heat. How will they manage that?
Isn't stacking practically gluing two processors on top of one another, and isn't heat dissipation a big issue already?
Do they have some new ideas how to transfer heat? Spreading the dye allows for bigger area to dissipate heat to the cooler, how would be an exaggerated example like a cube cpu be cooled? Wouldn't the core, inside melt while the outer layer is barely hot?
I've heard there is a technique that uses some kind of 'micro chimneys'; a kind of vias between layers.
Good work carry on...
Thank you for this wonderful explanation of the newest direction. I can't help but wonder, as many others here do, how cooling will be handled, and how those systems evolve with new/better ideas. Well done video.
I studied and worked in electronics for years before I realized that integrated circuits were planar in their construction with layers of metal above for routing.
I had assumed that they were always 3D and that this had been done long ago (this was in the early 1990s).
I was shocked to learn this was a futuristic pipe dream that was decades from realization.
I have now lived long enough to see my naïve assumption realized.
very good news regarding the development of new technologies in transistor manufacturing. It would be even better if the chip makers worked with each other. And don’t be hampered by licensed technologists. The whole explanation of the operation is great but I'm worried that the transistors will overheat and break down in the middle part of the chip. so I would like to see a vertical nano graphite tube or something similar to facilitate heat removal.
Its a good insight whats going on in the tec scene.
True, the future of chip is in staking them. By the way, really good and nice explanations.
Lets build an Anastasi Asic...... Great videos girl!
Great video, 3D is the only way to overcome Moore's Law which is bottoming out on the 2D level.
BTW CC sucks @ 1:32 "leave me know and trust lowest Klaten Astagfirullahaladzim" 🤔
Beauty on Beauty (BoB) is definitely the future of IC designs
3D STACKING IS COMMMINGGGG
Thank you for this video 💚
i have envisioned 3d procesors a long time ago. i wonder if they took advantage of component placement to reduce path distance.
The biggest challenge with 3D stacking is heat dissipation.
Domino effect . More accurate optics , litography . require extremely clean environements.
Thank you!
Cooling will always be the problem until we can learn to integrate graphene and/or photon technology into the chip designs.
@@godslayer1415 Why?
yes, but stacking decreases the average wirelength, which decreases the energy needs for those chips stacked, compared to the same chips next to each other.
Great, keep up the very good work you are doing.
My question, as pertaining to Intel specifically, will they use 3D stacking technology for their current CISC designs, is it a hybrid of CISC and RISC or will they be moving to RISC exclusively? By the way, this type of technology was actually mentioned in the "Terminator 2" movie. Check it out!
A hybrid between more powerful cores and less powerful cores. Both types technically CISC x86. x86 instructions already get converted into 4 byte long RISC-like micro-operations.
@@perforongo9078 Just stating all CISC instructions get translated into 4byte RISC ones is outright wrong.
The problem in computing is heat. They can stack a bunch of transistors on top of each other but heat is the issue
Nice 😄
Loved the videos, will photonic chips not really be the future,? Surly this is limited aswell
Cooling issue is problem, you just can't put cooler in every layer. Unless you create a 4D cooler.
Cooling 'em is gonna be problematic though ... more forward thinking designers will want to integrate cooling channels or heat pipes in the design sandwich.
thank you
This is why I own their stock! The Future!!!
Miles Bennett Dyson Neural Net CPU. A 3D Terminator chip.
Soon, “user upgradability” will be “fond memory”
seems like the natural progression.
I know nothing about chip design, and very little about integrated circuits, but interestingly when I was thinking about how a chip or a integrated circuit was made, I assumed it was stacked because in my mind that was the most efficient.
Something similar to graphine crystal chips......
I can see Multiple Chip Module 3D
Quantum computers and optical driven CPUS etc.
This video was awesome! Do you have an accent?
Could you make a video on spintronics? It would be amazing.
If there ever is a terminator from the future, it's her -.-
next step will be stacking soc's then next will be making the gaps more smaller next will be changing material from silicon to other and then they will change the way the chips calculate using quantum computing
Объединение разнородных чипов в один блок без должного охлаждения будет приводить к серьезной нестабильности в работе. Получается, что процессор разогревает находящуюся на нём память и графический чип греет эту память и все друг-друга греют. В общем, место сэкономили на чипе, но потеряли на модулях охлаждения.
wow smart and bellisima.. me encanta
Plz make a video on photonics
ok :)
God, you are so cute, and love your voice! Plus super smart, awesome. I wish I could pick your mind apart about computer hardware and software. But I'm way past in that. You would have loved to get hold of one of my computers that I made for people. It would blow most people away! Peace and love to all
Knowledgeable and drop-dead gorgeous too.
just a follow up on the background music, the high repetitiveness and swoosh pitch toward the end is actually annoying af. But nonetheless, I learned a great deal in your videos. Thank you! Just would like to concentrate more on ur actual content.
Anastasi, thank you for your coverage of chip technology. Can you cover what will come after the silicon chip like graphene chip and photonic chip once the current state of silicon based chip reach the physical limit, even with 3D tech?
Also, how many years are we away from reaching the physical limit of silicon based chip?
Thank you.
Did they say anything about cooling ?
THANKS4GIVING
Thank you for such wonderful video. But, the background “music” might not be necessary.
Intel also should be at par with apple, s m1ultra chip technology. They should not only manufacturing micro chips with old technology whereas they should invest their profit which they have earned till date in manufacturing chips with latest technology. Now artificial intelligence based robots are being created all over the world. Highest memory power is required to activate these robots. Hence processors in these chips with multi core transisters should be produced with neural network. All big chip giants like intel, samsung and ibm etc., should keep this in mind to copeup with future scientific advancement . Scientific advancement has gone to himalayan heights. Advanced technology in manufacturing computer chips is very very essential for ai based machines and robots. Thanks
silicon on sapphire is it still relevant or not? Question to you as a specialist at new high technology.
Great content! but could u tune down the background music? that imo is interfering with all the very technical stuff you have to say
The next generation of compute modules are going to have to solve ridiculous thermal management issues.
👍
Won't the chip get heated much more faster especially the one below?
Awesome technology 😁
Mmm it sounds nothin particular : the problem no one did it before is heating. It's now more required by mobile devices. In a decent pc you might appreciate a second integrated video card in case of failure but most of the time you want a videocard chosen indipendently from cpu. So I think this new solution can improve mostly mobile and servers but not that much workstations
She is amazing !!!
Stacking is nice, but this technique cannot double the speed every 2 years. (More's law). Stacking is limited because of the heat. Going a lot smaller cant happen too because of quantum jumping and tunneling. The next big jump will be quantum computing and off-device computing, where part of the calculations are done on a remote server. To make computers faster in the coming years, a lot will be done by smarter programming and better compression techniques. I.A. will also fine tune the way we calculate so that programs can run on "slower" devices. It will be a mix of many fields that together will move us forwards. Before it was almost only hardware that speeded up, but now it's a broad effort.
And then light computing, that is 1000 times faster, probably. I would say 2040 is the year, when light processors will be there for people
O sea ahora casi no hace falta una placa madre pues todos los componentes están en un sólo encapsulado
i didnt understand a damn thing but i liked the video
wonder if intel will do an intel and make mindblowing CPU's with this and completely fumble it at the thermal solution they pair with it.
I was thinking the same thing. These 3D chips will definitely need more thought out thermal solution than what we currently have.
"technology limits". Why say that, to me, it just does not make sense. I am sure they said the same when they were building a 144kbs US Robotics modem. LOL. The limit we reached is not in technology but in current knowledge. We ran into a wall that needs to be taken down to move forward! .
If the future is SoC like M1, how RAM manufactures will react? Because CPU, GPU, RAM will be made by the same company, and also the issue of non upgradable desktops...
RAM manufacturers will simply adapt by selling their IP for RAM components like ARM does with its processor cores. Chip designers will simply purchase the license to use the RAM manufacturer’s design and incorporate it into their own custom SoC and wrap their own IP on top of it.
Nothing. Just sell the RAM dies to SoC makers. The Apple M1, M1 Pro and M1 Max integrate separate RAM dies to the CPU/GPU/ISP/AI core die in one package. The RAM lies in separate dies. It is not optimal to design RAM on the same die as CPU/GPU. They only put some L1 and L2 cache in the same die as CPU/GPU. Those cache RAM's size is small.
Hi , I want to pursue a career on digital design or verification front end. Does ending of Moore's law affect the job market ? If so may I consider mixel signal or physical design ? (Masters )
In the future our processors will just be silver rods towering above the motherboard.
Heat
Sounds interesting but, doesn’t‘photonics ‘ preempt all those theories.china’s photonics is very advanced !
Really? China's photonics has never been advanced, nor has it mass-produced 14nm chips.
cooling?
Why is TSMC trying to bring Holographic World of Warcraft technology to our lives?
06:13
Ai && iA
That is great and all but we need the scalpers to leave them alone so we can buy them. As you may know they hoard things for the sole purpose of selling them for a much higher price. It should be grossly illegal and punished very harshly worldwide really.
Isn’t this just like the M1 chip?
Trademark battle! lol
WoW = World Of Warcraft
Can they make 4D chip?🤣🤣🤣🤣🤣
So LEGO for computer fanatics?
Please, turn on russian subtitles
I thought intel had done this years ago?
Interesting, I have no idea what she's talking about but watch anyway. She is discussing new technology in a second language! Oh and she is pretty.
But today's processors are more than enough. It is came to a point where computations are simply not used for human benefits. You don't use any software that can check reactions of chemicals on your body, you just don't have access to it. And so animals are still suffer. Computations are barely used.
Keep Moore's law going ? modern computers are decades past Moore's law
"sree dee" chips 😁
AMD bringing more power at low cost. Wow
So they're copying the Atari Jaguar, are they?
3d chips ? Oh ! Skynet chips are like that. 😂 Maybe they have a T-1000 chip somewhere and they are doing reverse engineering.
How do manufacturers deal with the "known good die" issue for 3D microchips?
I just have to wonder, from a security perspective, could these be vulnerable to a rowhammer-style attack with voltage leakage?
@@godslayer1415 Yes, it is. It is an attack using voltage leakage across cells to change bits in neighboring cells. Voltage leakage at these scales is a problem engineers need deal with everywhere. It's not inconceivable that voltage leakage could affect affect a gate, and gates nearby, and that could create a vulnerability.
Unreal 5